Murata Manufacturing Co., Ltd.

Akihiro Hara

Nobumitsu Amachi

Takahiro Watanabe

Kazushige Sato

Yoshikazu Yagi

Noboru Morioka

Masahiko Ura

A high-frequency component includes a wiring substrate, a component mounted on an upper surface of the wiring substrate, a columnar member formed of a conductive resin and standing on the upper surface of the wiring substrate in a state of a lower end portion of the columnar member being fixed to the upper surface of the wiring substrate, and a shield case covering the component and the columnar member. The shield case has a lid plate disposed so as to face the upper surface of the wiring substrate and a side plate extending from an edge of the lid plate toward the upper surface of the wiring substrate, and an upper end portion of the columnar member is fixed to each of four corner portions of the lid plate, when viewed in a direction perpendicular to the upper surface of the wiring substrate.

High-frequency component provided with a shield case

Provided is a technique capable of improving isolation characteristics between a plurality of signal paths through which RF signals pass, without using ground electrodes or the like. Wiring electrodesandthrough which RF signals do not pass simultaneously are formed so as to be adjacent to each other in a central region of a component mounting surfaceof a circuit board, and wiring electrodesandthrough which RF signals pass simultaneously are formed so as to be distanced from transmission pathsand. Accordingly, the RF signals do not simultaneously pass through the transmission pathsand, which are disposed near each other, and thus there is no risk that the RF signal passing through one of the signal paths will interfere with the RF signal passing through the other signal path.

Composite module

Growing community of inventors

Kyoto, Japan

Akihiro Hara