Fujifilm Corporation

Akihiro Hakamata

Naoya Shimoju

Yuichiro Goto

Keiichi Tateishi

Akinori Shibuya

Yoshihiko Fujie

Kazunari M Yagi

Takashi Iizumi

Tatsuya Shimoyama

Provided are: a composition for forming an underlayer film for imprinting, which contains a high-molecular-weight compound having a polymerizable group, a chelating agent, and a solvent, and a method for producing the same; a kit including the composition for forming an underlayer film; a pattern producing method using the composition for forming an underlayer film; and a method for manufacturing a semiconductor element, which includes the pattern producing method as a step.

Composition for forming underlayer film for imprinting, method for producing composition for forming underlayer film, kit, pattern producing method, and method for manufacturing semiconductor element

Provided are a curable composition used for forming an interlayer existing between a base material and a curable layer, the curable composition including a curable main agent having a polymerizable functional group, a polymerization inhibitor, and a solvent, in which a content of the polymerization inhibitor is 1 part by mass or greater and lower than 1,000 parts by mass with respect to 1,000,000 parts by mass of the curable main agent; a kit including the curable composition; an interlayer formed from the curable composition; a laminate including the interlayer; an imprint pattern producing method using the laminate; and a method for manufacturing a device including the imprint pattern producing method.

Curable composition, kit, interlayer, laminate, imprint pattern producing method, and method for manufacturing device

A composition for forming an underlayer film in an imprinting method, which includes a high-molecular-weight compound having a polymerizable functional group and a monomer having a plurality of crosslinking functional groups capable of being bonded to the polymerizable functional group, and in which a Hansen solubility parameter distance, which is a difference between a Hansen solubility parameter of the high-molecular-weight compound and a Hansen solubility parameter of the monomer, is 5.0 or less, and regarding the two crosslinking functional groups among the plurality of crosslinking functional groups, the number of atoms, which constitute a shortest atom chain mutually linking crosslinking points in the respective crosslinking functional groups, is 7 or more; a laminate including a layer formed of the composition for forming an underlayer film; and a method for manufacturing a semiconductor element, in which a semiconductor element is manufactured using a pattern obtained by a pattern producing method.

Composition for forming underlayer film in imprinting method, kit, pattern producing method, laminate, and method for manufacturing semiconductor element

Provided are a composition for forming an underlayer film for imprinting, including a curable component, and a particulate metal which has a particle diameter of 10 nm or larger, as measured by a single particle ICP-MASS method, and contains at least one kind of iron, copper, titanium, or lead, in which a content of the particulate metal is 50 ppt by mass to 10 ppb by mass with respect to the composition; a method for producing a composition for forming an underlayer film for imprinting; a pattern producing method; a method for manufacturing a semiconductor element; a cured product; and a kit.

Composition for forming underlayer film for imprinting, method for producing composition for forming underlayer film for imprinting, pattern producing method, method for manufacturing semiconductor element, cured product, and kit

Provided is a kit including a curable composition for imprinting which contains a polymerizable compound having an aromatic ring and a composition for forming an underlayer film for imprinting which contains a polymer and a solvent, in which the polymer contains at least one kind of specific constitutional unit and has a polymerizable group, a film formed of the composition for forming an underlayer film for imprinting is a solid film at 23° C., and a portion that has a continuous partial structure containing an aromatic ring which is included in the polymerizable compound and accounts for 60% by mass or more of the polymerizable compound is common to a continuous partial structure containing an aromatic ring which is included in a substituent R in a side chain in the polymer. Furthermore, the present invention relates to a composition for forming an underlayer film for imprinting which is used in combination with a curable composition for imprinting; a laminate; a method for producing a laminate; a method for producing a cured product pattern; and a method for manufacturing a circuit board.

Kit, composition for forming underlayer film for imprinting, laminate, and production method using the same

Provided is a kit including a curable composition for imprinting, and a composition for forming an underlayer film for imprinting, in which the composition for forming an underlayer film for imprinting contains a polymer having a polymerizable functional group, and a compound in which the lower one of a boiling point and a thermal decomposition temperature is 480&#xb0; C. or higher and &#x394;HSP, which is a Hansen solubility parameter distance from a component with the highest content contained in the curable composition for imprinting, is 2.5 or less. Furthermore, the present invention relates to a composition for forming an underlayer film for imprinting, a pattern forming method, and a method for manufacturing a semiconductor device, which are related to the kit.

Kit, composition for forming underlayer film for imprinting, pattern forming method, and method for manufacturing semiconductor device

A transfer film includes a temporary support; and a photosensitive layer, in which the photosensitive layer includes a polymer A containing a constitutional unit represented by Formula A1, a constitutional unit derived from a monomer having an alicyclic structure, and a constitutional unit having a radically polymerizable group, a radically polymerizable compound, and a photopolymerization initiator, a content of the constitutional unit represented by Formula A1 is 10% by mass or more with respect to a total mass of the polymer A, a content of the constitutional unit derived from the monomer having the alicyclic structure is 15% by mass or more with respect to a total mass of the polymer A, and a glass transition temperature of a homopolymer of the monomer having the alicyclic structure is 120&#xb0; C. or higher.

Transfer film, electrode protective film, laminate, capacitive input device, and manufacturing method of touch panel

Provided are: a coloring composition for dyeing including a compound represented by Formula (1) shown in this specification or a salt thereof; a coloring composition for textile printing in which the coloring composition for dyeing is used for textile printing; a compound which is preferable as a material of the coloring compositions; a textile printing method in which the above-described coloring composition for textile printing is used; an ink for ink jet textile printing including the above-described coloring composition for textile printing; and a dyed fabric.

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Kanagawa, Japan

Akihiro Hakamata