Sumitomo Chemical Company, Limited

Matsushita Electric Industrial Co., Ltd.

Hayashibara Biochemical Laboratories, Inc.

Akihiro Furuta

Takezo Sano

Yukikazu Uemura

Haruo Inoue

Nobuhiro Usui

Makoto Hanabata

Hiroyuki Takewa

Seimei Yasui

Mikio Iwasa

Kazue Satoh

Yuji Nakai

Tadanori Inoue

Kuniaki Sakai

Tetsuya Tanaka

Yasunori Uetani

Masahito Matsumoto

Nobuo Higaki

Shinya Mizone

Kunihiko Tanaka

Katsuji Ueno

Jun Tomioka

Haruyoshi Osaki

Takeshi Hioki

Satoru Funakoshi

Ryotaro Hanawa

Fumio Oi

Kaoru Iwakuni

Naoyoshi Jinno

Tsuneyuki Suzuki

Shinji Konishi

Takanori Yamamoto

Osamu Hiroaki

Takao Ninomiya

Toru Inoue

The present invention provides a DMA transfer controller includes: a transfer parameter storing unit for storing a bus occupation time value and transfer parameters of one set or a plurality of sets of DMA transfers for each of a plurality of logical processors; a data transfer performing unit for performing the DMA transfer on the basis of the DMA transfer parameters; a control unit for controlling the receive and transmit of the DMA transfer parameters and the start and the interruption of the DMA transfers; and a time measuring unit for starting to measure bus occupation elapse time when a first DMA transfer is started for each of the logical processors. When the bus occupation elapse time reaches the bus occupation time value, the control unit interrupts the DMA transfer that is currently performed to start the DMA transfers based on the transfer parameters related to the logical processors of a prescribed sequence.

DMA controller for controlling and measuring the bus occupation time value for a plurality of DMA transfers

The deinterleaving device of this invention deinterleaves an input transmission frame and outputs the deinterleaved frame, the transmission frame being obtained by performing inter-frame interleaving for an original frame to form an intermediate frame and performing inner-segment interleaving for at least one data segment included in the intermediate frame. The deinterleaving device includes: a memory; a data write section for receiving the transmission frame and writing the transmission frame into the memory; and a data read section for releasing the inter-frame interleaving and the inner-segment interleaving simultaneously when reading data from the memory and outputting the data.

Deinterleaving device that releases a plurality of types of interleaving simultaneously

In fast Fourier transform, a necessary memory capacity is decreased, thereby decreasing a cost. The fast Fourier transform is performed on a symbol stored in a RAM by a butterfly operation unit in accordance with a RAM address generated by a RAM address generator. A RAM address conversion unit converts an input/output dummy address into an input/output real address by conducting bit reverse by a frequency specified in accordance with an input/output bit reverse signal, and converts a butterfly operation dummy address into a butterfly operation real address by conducting the bit reverse by a frequency specified in accordance with a butterfly operation bit reverse signal. In this manner, among output data of one symbol and input data of another symbol to be stored in the RAM subsequently to the output data of the one symbol, data having a common index indicating their orders in the symbols can be stored at the same address in the RAM. As a result, symbol input and symbol output can be overlapped.

Fast fourier transforming apparatus and method, variable bit reverse circuit, inverse fast fourier transforming apparatus and method, and OFDM receiver and transmitter

Process for producing hollow resin molded article

A process for producing a thermoplastic resin hollow molded article is disclosed. The process takes place in a molding machine including first and second mold halves having respective mold surfaces defining a mold cavity. At least one of the mold halves is movable relative to the other mold half to permit the mold surfaces to be moved both towards and away from each other between closed state and unclosed states. At least the first mold half has incorporated therein at least one slidable block defining a portion of the mold surface of the first mold half. According to the process, thermoplastic resin is supplied in a molten state between the mold surfaces while the mold halves are in the unclosed state, and at least one of the mold halves is moved relative to the other mold half to press and spread the thermoplastic resin so that the cavity is filled with the thermoplastic resin. During the process, compressed gas is supplied into the thermoplastic resin located in the cavity. In order to permit expansion of the thermoplastic resin caused by the compressed gas, the slidable block is moved from away from the cavity along the same direction that the mold halves move. The mold is then opened and the thermoplastic resin hollow molded article is removed from the mold cavity.

Process for producing thermoplastic resin hollow molded article

In fast Fourier transform, a necessary memory capacity is decreased, thereby decreasing a cost. The fast Fourier transform is performed on a symbol stored in a random access memory (RAM) by a butterfly operation unit in accordance with a RAM address generated by a RAM address generator. A RAM address conversion unit converts an input/output dummy address into an input/output real address by conducting bit reverse by a frequency specified in accordance with an input/output bit reverse signal, and converts a butterfly operation dummy address into a butterfly operation real address by conducting the bit reverse by a frequency specified in accordance with a butterfly operation bit reverse signal. In this manner, among output data of one symbol and input data of another symbol to be stored in the RAM subsequently to the output data of the one symbol, data having a common index indicating their orders in the symbols can be stored at the same address in the RAM. As a result, symbol input and symbol output can be overlapped.

Fast fourier transforming apparatus and method, variable bit reverse

A process for producing a hollow article in an assembly comprising first and second mold members movable relative to each other between a closed position in which an inner surface of the assembly defines a cavity and an open position. The cavity is shaped to define a corresponding configuration to the article. According to this process, a charge containing at least one molten thermoplastic resin is supplied at the first and/or second mold member while the mold members are not in the closed position. The first mold member is moved relative to the second mold member into the closed position so as to define the cavity, and a first clamping force F1 is applied to the first and second mold members. The charge is then compressed within the mold cavity under the first clamping force F1. Thereafter, the clamping force is reduced from the first clamping force F1 to a second clamping force F2 before the molten thermoplastic resin in the mold cavity has completely solidified. A compressed gas is supplied into at least one unsolidified portion of the molten thermoplastic resin subsequent to the step of closing the mold members and before the molten thermoplastic resin in the mold cavity has completely solidified. The molten thermoplastic resin can then be cooled in the mold cavity and solidified while supplying the compressed gas.

Process for producing molded article having a hollow portion from a

A speaker has a diaphragm of which plane shape as seen from a vibrating direction has a major axis and a minor axis, a band-shaped edge connected to the outer circumference of the diaphragm for holding so that the diaphragm may be free to vibrate, and a frame for holding the outer circumference of the edge, wherein a viscoelastic member is affixed to part of the edge and/or diaphragm.

Speaker

The loudspeaker of the invention includes: a frame; a diaphragm, a planar shape thereof being non-axisymmetric having a larger diameter and a smaller diameter when the diaphragm is viewed from a vibration direction thereof; a band-shaped edge portion provided around an outer periphery of the diaphragm, an outer periphery of the edge portion being connected to the frame and an inner periphery of the edge portion being connected to the diaphragm; a cylindrical voice coil bobbin in a non-axisymmetric shape having a larger diameter and a smaller diameter which includes a pair of opposed faces parallel to each other in a larger diameter direction, one end portion of the voice coil bobbin being connected to the diaphragm; a voice coil wound around the voice coil bobbin; a plurality of voice coil bobbin reinforcing members in a plate shape which are bridged between the pair of opposed faces parallel to each other of the voice coil bobbin; and a plurality of magnetic circuits having a gap for applying magnetic fluxes to at least a part of the voice coil.

Loudspeaker

A photoresist composition which includes a sensitizing compound, a resin and, as a light absorber, a styryl compound of the formula: ##STR1## wherein R.sub.1, R.sub.2 and R.sub.11 are the same or different and a hydrogen atom, an optionally substituted alkyl, alkenyl or aralkyl group or R.sub.1 and R.sub.2 may form a ring together with the nitrogen atom to which they are bonded, which ring may include at least one hetero atom in addition to said nitrogen atom; R.sub.10 is an optionally substituted alkylene group; R.sub.3 is --OH, --OCOR.sub.5 or --OSi(R.sub.5).sub.3 in which R.sup.5 is an alkyl group; R.sub.12 and R.sub.13 are independently a hydrogen atom, an optionally substituted lower alkyl or alkoxy group, an amide group or a halogen atom; X, Y, W and Z are the same or different and an electron attracting group, and n is a number of 2-15.

Photoresist compositions comprising styryl compound

A positive type photoresist composition comprising a novolak resin and O-quinone diazide compound, the novolak resin being one which is obtained by the addition condensation reaction of a phenol and formaldehyde which is performed in one stage by using as a catalyst an organic acid salt of a divalent metal which is more electropositive than hydrogen, or in two stages by using an acid catalyst in the subsequent stage, the phenol being at least one compound represented by the formula ##STR1## wherein R is hydrogen or an alkyl group of carbon number 1 to 4, the compound being such that the average carbon number in the substituent per one phenol nucelus is 0.5 to 1.5 and the ones with the substituent at the ortho- or para-position with respect to the hydroxyl group account for less than 50 mol %, is disclosed. The positive type photoresist composition of the invention has an improved resolving power, i.e., .gamma.-value.

Positive type high gamma-value photoresist composition with novolak

A novolak resin for a positive photoresist is provided herein, which resin is produced by the addition condensation reaction of a phenol with formaldehyde. This novolak resin has improved heat resistant and sensitivity properties and the thickness retention of the novolak resins are very high. The novolak resins are characterized in that the area ratio of the gel permeation chromatographic pattern (GPC) as measured by the use of a UV(254 nm) detector, is as follows: a range wherein the molecular weight, calculated as polystyrene, is from 150 to less than 500, not including a phenol and the unreacted monomer, is from 8 to 35%, hereinafter referred to as an A region, the range wherein the molecular weight calculated as polystyrene is from 500 to less than 5000 is from 0 to 30%, hereinafter referred to as a B region, and the range wherein the molecular weight calculated as polystyrene exceeds 5000 is from 35 to 92%, hereinafter referred to as the C region, and wherein the ratio of the B region to the A region is 2.50 or less.

Novolak resin for positive photoresist

A positive type photoresist composition comprising an m-hydroxy-.alpha.-methylstyrene polymer and as a photo-sensitizer a quinonediazide compound is disclosed. A positive type photoresist composition comprising an m-hydroxy-.alpha.-methylstyrene polymer, a novolak resin, and as a photo-sensitizer a quinonediazide compound, is also disclosed.

Positive photoresist composition with m-hydroxy-.alpha.-methylstyrene

A resin composition based on a polyphenylene ether comprising 99 to 1 part by weight of a polyphenylene ether copolymer derived from 99.5 to 85 mole-% of 2,6-dimethylphenol and 0.5 to 15 mole-% of 3-methyl-6-tert-butylphenol and 1 to 99 parts by weight of a styrene polymer (making up 100 parts by weight in total); and said resin composition further containing 0.1 to 100 parts by weight of a rubber-like polymer for 100 parts by weight of the said resin composition. These resin compositions have excellent mechanical strength, heat resistance, and moldability and are suitable as molding resin materials in practical use fields.

Novel resin compositions based on polyphenylene ether

An improved process for producing a photo-curable composite material using a liquid photo-curable resin, which comprises holding a liquid photo-curable resin with a screen material between two films, at least one of the films having photo-transmitting properties, and passing the films holding the liquid photo-curable resin and the screen material through a gap (e.g. between two rollers). The process of the present invention can produce photo-curable composite materials useful for preparing various stencils for screen printing, textile printing, or the like at a low cost and with less production of defects.

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Osaka, Japan

Akihiro Furuta