Nitto-denko Corporation

Akihiro Fukui

Naohide Takamoto

Hiroyuki Hanazono

The present invention is to provide a dicing-tape integrated film for the backside of a semiconductor that is capable of suppressing the increase of the peel strength between the dicing tape and the film for the backside of a flip-chip semiconductor due to heating. The dicing-tape integrated film for the backside of a semiconductor has a dicing tape having a substrate and a pressure-sensitive adhesive layer formed on the substrate and a film for the backside of a flip-chip semiconductor formed on the pressure-sensitive adhesive layer of the dicing tape, in which the difference (&#x3b3;2&#x2212;&#x3b3;1) of the surface free energy &#x3b3;2 and the surface free energy &#x3b3;1 is 10 mJ/mor more, where &#x3b3;1 represents the surface free energy of the pressure-sensitive adhesive layer and &#x3b3;2 represents the surface free energy of the film for the backside of a flip-chip semiconductor.

Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device

An underfill material having sufficient curing reactivity, and capable of achieving a small change in viscosity and good electrical connection even when loaded with thermal history, a laminated sheet including the underfill material, and a method for manufacturing a semiconductor device. The underfill material has a melt viscosity at 150&#xb0; C. before heating treatment of 50 Pa&#xb7;s or more and 3,000 Pa&#xb7;s or less, a viscosity change rate of 500% or less, at 150&#xb0; C. as a result of the heating treatment, and a reaction rate represented by {(Qt&#x2212;Qh)/Qt}&#xd7;100% of 90% or more, where Qt is a total calorific value in a process of temperature rise from &#x2212;50&#xb0; C. to 300&#xb0; C. and Qh is a total calorific value in a process of temperature rise from &#x2212;50&#xb0; C. to 300&#xb0; C. after heating at 175&#xb0; C. for 2 hours in a DSC measurement.

Underfill material, laminated sheet and method for producing semiconductor device

The present invention is to provide a dicing-tape integrated film for the backside of a semiconductor that is capable of suppressing the transfer of the coloring agent contained in a film for the backside of a flip-chip semiconductor formed on the pressure-sensitive adhesive layer of the dicing tape onto the dicing tape. The dicing-tape integrated film for the backside of a semiconductor has a dicing tape having a substrate and a pressure-sensitive adhesive layer formed on the substrate and a film for the backside of a flip-chip semiconductor formed on the pressure-sensitive adhesive layer of the dicing tape, the film for the backside of a flip-chip semiconductor contains a coloring agent, and the solubility of the coloring agent to toluene at 23&#xb0; C. is 2 g/100 ml or less.

Growing community of inventors

Ibaraki, Japan

Akihiro Fukui