Dowa Electronics Materials Co., Ltd.

Akihiro Asano

Kenichi Inoue

Masahiro Yoshida

Atsushi Ebara

Kozo Ogi

Shinichi Suenaga

Yuki Kaneshiro

Hideyuki Fujimoto

To provide a silver-bismuth powder, which includes: silver; and bismuth, wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 40:60, wherein a cumulative 50% point of particle diameter (D50) of the silver-bismuth powder in a volume-based particle size distribution thereof as measured by a laser diffraction particle size distribution analysis is 0.1 &#x3bc;m to 10 &#x3bc;m, and wherein an oxygen content of the silver-bismuth powder is 5.5% by mass or less.

Silver-bismuth powder, conductive paste and conductive film

There are provided a cuprous oxide powder having a smaller particle diameter than that of conventional cuprous oxide powders, and a method for producing the cuprous oxide powder by a chemical reducing process. In a method for producing a cuprous oxide powder by adding a reducing agent, such as a reducing sugar, to a solution containing copper hydroxide, which is formed by adding one of an alkali solution and a copper ion containing solution to the other thereof, to deposit cuprous oxide particles by reduction, 0.00001 to 0.04 moles (10 to 40000 ppm) of ferrous ions with respect to the amount of copper ions in the copper ion containing solution are added to the copper ion containing solution before forming copper hydroxide, to produce a cuprous oxide powder which has a mean primary particle diameter of not greater than 0.5 micrometers when it is measured by a scanning electron microscope (SEM), the cuprous oxide powder having a 50% particle diameter (Ddiameter) of not greater than 0.8 micrometers when it is calculated by a laser diffraction particle size analysis, the cuprous oxide powder containing 30 ppm or more of iron.

Cuprous oxide powder and method for producing same

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Tokyo, Japan

Akihiro Asano