Matsushita Electric Industrial Co., Ltd.

Akihiko Wachi

Nobuyasu Nagafuku

Nobuyuki Kakishima

Ken Takahashi

Takao Naito

Masaya Matsumoto

Seishiro Yanachi

Naoichi Chikahisa

Yousuke Nagasawa

Takeshi Kuribayashi

Hiroshi Uchiyama

Hitoshi Nakahira

Toshiyuki Koyama

Takayuki Mibuchi

Tetsuya Tanaka

Noboru Nishikawa

Toshiyuki Kinoh

Hiroyoshi Saito

An occurrence of component lack at a component arrangement position, designated by a mounting program, of a component feed part, which feeds components to be mounted, is determined. Whether a spare component for the lacking component to be mounted is present in a spare component feed area of the component feed part is determined, and supply of the component to be mounted from a designated component arrangement position of the component feed part is switched to supply of the spare component from the spare component feed area.

Method and apparatus for feeding components, and method and apparatus for mounting components

An occurrence component lack at a component arrangement position, designated by a mounting program, of a component feed part, which feeds components to be mounted, is determined. Whether a spare component for the lacking component to be mounted is present in a spare component feed area of the component feed part is determined, and supply of the component to be mounted from a designated component arrangement position of the component feed part is switched to supply of the spare component from the spare component feed area.

Method for feeding a component

An algorithm for determining the movement of camera for automatic tracing of inspection positions is preset based on the characteristic shape of the component. A start point and an end point of inspection of lands are designated to the camera, and the camera moves from the start point to the end point automatically along a predetermined path in accordance with the preset algorithm, thereby performing inspection of lands in succession.

Inspection method and device by movement of the field of view of the camera

The present invention relates to a control method for improving the productivity of a screen printer for an electronics-mounting machine. Thus, a screen printer according to this invention uses a recognition camera to inspect the results of printing of a circuit board concurrently with a cleaning operation of the rear surface of a screen, thereby enabling the effective use of time. This screen printer also enables cream solder to be automatically supplied to reduce the operation time by determining whether the next screen to be used is unused. During automatic screen replacement, this screen printer enables a desired screen stored in the corresponding stocker to be automatically specified in order to replace the current screen in response to a selected NC program.

Method for controlling screen printer

A screen printing method and apparatus for printing a circuit pattern corresponding to that of a stencil ( ), onto a print-object article ( ) placed on an ascendable/descendable positioning stage ( ), through moving a squeegee ( ) horizontally while the squeegee is pushed in on the stencil so that print paste ( ) is printed to the article via the stencil. The squeegee is lifted to an extent of a push-in stroke, to which the squeegee has been pushed in on the stencil, and thereafter the article is separated away from the stencil by moving the stage downward. The board is classified into first and second areas ( ) where values of opening sizes of the stencil along a squeegee moving direction are smaller than and not smaller than a threshold, and a speed of the squeegee at the first area is made slower than that at the second area. Upon an occurrence of print standby time during a printing operation, the print standby time is measured, and at a resumption of printing with the print standby canceled, the paste placed on the stencil during the standby time is screen-printed, by moving the squeegee at an adjusted print speed lower than the reference print speed based on a relationship between the print standby time and a print time due to the adjusted print speed after the resumption of printing.

Screen printing method and screen printing apparatus

The present invention provides an apparatus and a method for operating reflow soldering in a mounting field whereby an abnormality in transfer of circuit boards can be detected with high reliability. Whether or not a circuit board is transferred by a transfer conveyor is judged. A discharge conveyor is started when a control device judges occurrence of transfer abnormality. After the discharge conveyor starts, the transfer abnormality is determined to be a drop of the circuit board if a discharge completion detector detects that a dropped circuit board is discharged. And then the control device continues the reflow soldering. The transfer abnormality in the reflow soldering apparatus can be detected with high reliability because it can be detected whether the transfer abnormality is either the drop or a clog of the circuit board.

Reflow soldering apparatus and method

An adhesive applying apparatus having an adhesive applying nozzle ( ), an elevation drive unit (B) for vertically moving the adhesive applying nozzle, a purging station ( ) provided with a purging tape ( ), a unit ( ) for supporting a circuit board ( ) and an X-Y direction drive unit ( ) which moves the adhesive applying nozzle so as to position the adhesive applying nozzle in a specified position in a horizontal direction of the circuit board and the purging tape. The elevation drive unit is constructed so as to be able to selectively set the lowermost end position of the adhesive applying nozzle. Also, a control means (D) is provided for controlling the elevation drive unit with a command in order to set the lowermost end position of the adhesive applying nozzle, located in a position above the purging station, to a specified position.

Adhesive applying apparatus

A screen printing method and apparatus for printing a circuit pattern corresponding to that of a stencil (,), onto a print-object article (,) placed on an ascendable/descendable positioning stage (,), through moving a squeegee (,) horizontally while the squeegee is pushed in on the stencil so that print paste (,) is printed to the article via the stencil. The squeegee is lifted to an extent of a push-in stroke, to which the squeegee has been pushed in on the stencil, and thereafter the article is separated away from the stencil by moving the stage downward. The board is classified into first and second areas (,) where values of opening sizes of the stencil along a squeegee moving direction are smaller than and not smaller than a threshold, and a speed of the squeegee at the first area is made slower than that at the second area. Upon an occurrence of print standby time during a printing operation, the print standby time is measured, and at a resumption of printing with the print standby canceled, the paste placed on the stencil during the standby time is screen-printed, by moving the squeegee at an adjusted print speed lower than the reference print speed based on a relationship between the print standby time and a print time due to the adjusted print speed after the resumption of printing.

Screen printing method and apparatus therefor

The invention provides an adhesive applying method which makes it possible to perform a stabilized adhesive applying operation and to reduce the overall production time. In detecting the amount of adhesive applied and performing a corrective operation so as to ensure application of a predetermined amount of adhesive, a corrected value obtained by a corrective operation is stored at step #5. At step #7, an infinitesimal correction formula which shows the relationship of the corrected value with respect to the amount of adhesive used is found on the basis of the corrected values stored last time and this time and on the basis of the amount of adhesive used during the time from the preceding corrective operation and the current corrective operation. And a productive corrected value found by the infinitesimal correction formula is used for adhesive application from the next time on.

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Nakakoma-gun, Japan

Akihiko Wachi