Canon Kabushiki Kaisha

Nec Corporation

Canon Kabushiki Kaisha Kaisha

Akihiko Okano

Masahiko Kubota

Shoji Shiba

Hiroe Ishikura

Tamaki Sato

Ryoji Kanri

Takumi Suzuki

Kazuhiro Asai

Atsushi Hiramoto

Yoshinori Tagawa

Maki Kato

Yoshiyuki Fukumoto

Masafumi Morisue

Maki Hatta

Masataka Sakurai

Atsunori Terasaki

Masaki Ohsumi

Etsuko Hino

Wataru Hiyama

Yoshiyuki Nakagawa

Ken Tsuchii

Yoshikazu Saito

Akiko Saito

Shinji Kishikawa

Tetsushi Ishikawa

Shinsuke Tsuji

Yoshiaki Kurihara

Yasuaki Tominaga

Kosuke Kurachi

Tatsuya Masukawa

Kazuaki Iwase

A method of forming a space includes a step of tenting, on a substrate having a recessed portion, a dry film including a dry film material that is to be a top plate on the recessed portion. The step of tenting the dry film includes a press period and a release period and performs a press-release cycle of the press period and the release period a plurality of times, a pressed state in which the dry film is pressed against the substrate by using a pressing member is maintained during the press period, and a released state in which the pressed state is released is maintained during the release period.

Method of forming space for use in analysis devices

There is provided a method for laminating a smooth thin resin layer on a substrate in manufacturing a liquid ejection head by a casting method. To achieve this, a resin layer having a sufficient thickness to fill a concave portion already existing on the substrate is applied and smoothed. Thereafter, a plurality of opening patterns (concave portions) are formed and then smoothed again to obtain a thin resin layer having a desired thickness.

Method for manufacturing liquid ejection head

There is provided a method for forming a smooth resin layer on a substrate having a concavo-convex portion in manufacturing a liquid ejection head by a casting method. To achieve this, after forming an opening pattern on the resin layer formed on the substrate, a mold is brought into contact with the resin layer at a predetermined pressure so as to smooth a surface of the resin layer.

A method for producing a liquid ejecting head of the present invention includes the steps of: forming an etching stop layer on a portion corresponding to a region in which an independent supply port is formed, on a first face of a substrate; conducting dry etching treatment for the substrate from a second face side until the etched portion reaches the etching stop layer; and removing the etching stop layer by isotropic etching to form the independent supply port, after having conducted the dry etching treatment, wherein the isotropic etching is conducted in such a state that a side etching stopper portion having etching resistance to the isotropic etching is formed in the side face perimeter of the etching stop layer.

Liquid ejecting head and method for producing the same

A method of manufacturing a liquid ejection head includes the steps of (1) forming a recess in a second surface of a substrate to form a common supply port, (2) forming an etching mask, which specifies opening positions of independent supply ports, on a bottom surface of the common supply port, and (3) performing ion etching using plasma with the etching mask employed as a mask, thereby forming the independent supply ports. The etching mask has an opening pattern formed therein such that respective distances from an ejection energy generation element to openings of two independent supply ports adjacent to the ejection energy generation element on the first surface side of the substrate are equal to each other.

Liquid ejection head and method of manufacturing same

A processing method of a silicon substrate including forming a second opening in a bottom portion of a first opening using a patterning mask having a pattern opening by plasma reactive ion etching. The reactive ion etching is performed with a shield structure formed in or on the silicon substrate, the shield structure preventing inside of the first opening from being exposed to the plasma.

Processing method of silicon substrate and liquid ejection head manufacturing method

A laser processing method of processing an object to be processed. The object to be processed has a modified portion and a non-modified portion. A modified layer forming step forms a modified layer of the object to be processed by scanning an inner portion of the object with a condensing point of first laser light. The modified layer (i) has a processing speed with second laser light that is lower than a processing speed of a non-modified portion and (ii) is formed below the non-modified portion. A removing step removes a portion of the non-modified portion. The portion of the non-modified portion ranges from a surface of the object to the modified layer. The removing step includes irradiating the portion of the non-modified portion with the second laser light.

Laser processing method

A method for manufacturing a liquid discharge head including a substrate on which supply ports for supplying a liquid are provided, includes forming a first supply port among the supply ports by performing crystal anisotropic etching on the substrate from one surface of the substrate, and forming a plurality of second supply ports among the supply ports by performing dry etching on the substrate using a crystal anisotropic etching method from a surface exposed toward the one surface of the substrate to a rear surface so that the independent second supply ports are respectively opened on the rear surface.

Method for manufacturing liquid discharge head

A manufacturing method of a liquid ejection head provided with a flow passage communicating with an ejection outlet for ejecting liquid includes steps of preparing a substrate on which a flow passage wall forming member for forming a part of a wall of the flow passage and a solid layer having a shape of a part of the flow passage contact each other, wherein the flow passage wall forming member has a height, from a surface of the substrate, substantially equal to that of the solid layer; providing on the solid layer a pattern having a shape of another part of the flow passage; providing a coating layer, for forming another part of the wall of the flow passage, so as to coat the pattern; providing the ejection outlet to the coating layer; and forming the flow passage by removing the solid layer and the pattern.

Manufacturing method of liquid ejection head

A liquid ejection head manufacturing method includes, in the following order, preparing a substrate having a flow path mold; arranging a first layer serving as a flow path wall member so as to cover the flow path mold; curing a portion of the first layer serving as a flow path sidewall; arranging a second layer so as to cover the cured portion of the first layer and the flow path mold; planarizing the second layer by pressing the second layer toward the substrate; arranging the ejection port in the first layer and the second layer; and forming the flow path by removing the flow path mold.

Liquid ejection head manufacturing method

Provided is a liquid ejection head including a substrate including a liquid supply port and an energy generating element, in which the liquid supply port has at least one groove shape formed in a wall surface thereof, the at least one groove shape extending from a rear surface, which is a surface opposite to a front surface on which the energy generating element is formed, toward the front surface.

Liquid ejection head and manufacturing method therefor

An ink jet head includes a Si substrate with a surface having a {100} orientation; a passage holding ink on the Si substrate; an ink discharge port which is communicatively connected to the passage and through which ink is ejected; and a supply port which extends through the Si substrate, which is communicatively connected to the passage, and which supplies ink to the passage. The supply port has walls having two {111} planes facing each other.

Ink jet head and method of manufacturing the same

A liquid discharge head includes an Si substrate which is provided with an element for generating energy used in discharging a liquid and a liquid supply port which is provided to pass through the Si substrate from a first surface to a rear surface so as to supply a liquid to the element. A method of manufacturing the substrate includes: forming a plurality of concave portions on the rear surface of the Si substrate of which a plane orientation is {100}, the concave portions facing the first surface and aligned in rows along a &#x3c;100&#x3e; direction of the Si substrate; and forming a plurality of the liquid supply ports by carrying out a crystal axis anisotropic etching on the Si substrate through the concave portions using an etching liquid of which an etching rate of the {100} plane of the Si substrate is slower than that of the {110} plane of the Si substrate.

Liquid discharge head and method of manufacturing a substrate for the liquid discharge head

A method for manufacturing a liquid discharge head includes the steps of: forming a solid layer for forming a flow path on a substrate on which an energy generating element is arranged to generate energy that is used to discharge liquid; forming, on the substrate where the solid layer is mounted, a coating layer for coating the solid layer; forming a discharge port used to discharge a liquid, through a photolithographic process, in the coating layer deposited on the solid layer; and removing the solid layer to form a flow path that communicates with the energy element and the discharge port. A material used for the coating layer contains a cationically polymerizable chemical compound, a cationic photopolymerization initiator and an inhibitor of cationic photopolymerization, and a material of the solid layer that forms a boundary with a portion where the discharge port of the coating layer is formed contains a copolymer of methacrylic acid and methacrylate ester.

Liquid discharge head manufacturing method, and liquid discharge head obtained using this method

A manufacturing method of a liquid ejection head includes forming on a substrate a first flow passage wall forming member contacting a solid layer of equal height, exposing a first layer of a negative photosensitive resin material to form an ejection outlet forming member; exposing a second layer, on the first layer, of a negative photosensitive resin material to form a second flow passage wall forming member for forming another part of the wall of the flow passage; placing the exposed first and second layers on the solid layer and the first flow passage wall forming member so that a non-exposed portion of the second layer contacts the solid layer; forming parts of the flow passage and the ejection outlet by removing non-exposed portions of the first and second layers above the substrate; and forming the flow passage by removing the solid layer.

Growing community of inventors

Fujisawa, Japan

Akihiko Okano