Hitachi, Ltd.

Hitachi Device Engineering Corp

Akihiko Narisawa

Makoto Kimura

Takahiro Fujioka

Shinji Tojo

Shinya Kanamitsu

Yoshiyuki Tanigawa

Koji Akimoto

Hiroyuki Mouri

Asao Nishimura

Kazuya Takahashi

Toshiaki Morita

Ryoichi Kajiwara

Masahiro Koizumi

Kazutoshi Itou

Masayoshi Shinoda

In a semiconductor device in which an LSI chip comprising electrodes with a 100 &mgr;m pitch or less and 50 or more pins is mounted directly on an organic substrate, a mounting structure and a manufacturing method thereof are provided excellent in the solder resistant reflow property, temperature cycle reliability and high temperature/high humidity reliability of the semiconductor device. Electrode Au bumps of the chip and an Au film at the uppermost surface of connection terminals of the substrate are directly flip-chip bonded by Au/Au metal bonding and the elongation of the bonded portion of the Au bump is 2 &mgr;m or more. The method of obtaining the bonded structure involves a process of supersonically bonding both of the bonding surfaces within 10 min after sputter cleaning, under the bonding conditions selected from room temperature on the side of the substrate, room temperature to 150&deg; C. on the side of the chip, a bonding load of &frac12;S&times;100 MPa to S&times;180 MPa (S: contact area between bump and chip), a loading mode increasing during bonding, and supersonic application time of 50 to 500 ms.

Semiconductor device and manufacturing method thereof

To provide a semiconductor device in which a thin resin film is provided on the whole margin of the principal plane of a semiconductor chip a lead is provided on the thin resin film, the lead is electrically connected with input and output electrode pads of the semiconductor chip, and the electrical joint is covered and sealed with a seal resin.

Semiconductor device and display unit using the semiconductor device and

To provide a semiconductor device in which a thin resin film is provided on the whole margin of the principal plane of a semiconductor chip, a lead is provided on the thin resin film, the lead is electrically connected with input and output electrode pads of the semiconductor chip, and the electrical joint is covered and sealed with a seal resin.

Growing community of inventors

Kodaira, Japan

Akihiko Narisawa