Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Sumitomo Riko Company Limited

Akihiko Namba

Keiji Onishi

Kazuo Eda

Tetsuyoshi Ogura

Yasunobu Tsukio

Yoshihiro Tomita

Osamu Kawasaki

Yosihiro Tomita

Katsunori Moritoki

Atsushi Komatsu

Hiroki Sato

Yasuhiro Sugaya

Yutaka Taguchi

Katsu Takeda

Hiroaki Ozeki

Masayuki Okano

Takashi Inoue

Toru Yamada

Takeshi Fujii

Atsushi Muramatsu

Koichi Hasegawa

Hiroshi Kagata

Susumu Fukushima

Katsumi Imada

Hidenori Katsumura

Shun-ichi Seki

Masato Sugimoto

Hajime Kurikuma

Satoshi Matsuo

Tetsuyosi Ogura

A power generator including: a vibration system configured to be attached to a vibrating member; and a power generating element attached to the vibration system. The vibration system is a multiple-degree-of-freedom vibration system that includes a first vibration system having a first mass member elastically supported by a first spring member, and a second vibration system having a second mass member elastically connected to the first mass member by a second spring member. The power generating element is arranged between the first and second mass members, and vibration applied from the vibrating member causes relative displacement of the first and second mass members so that vibration energy of the vibrating member is input to the power generating element. A natural frequency of the first vibration system is different from that of the second vibration system.

Power generator having a multiple-degree-of-freedom vibration system and a power generating element attached to the vibration system while converting vibration energy of a vibrating member to electrical energy

A synthesizer includes a synthesizer unit for generating a local oscillation signal based on a reference oscillation signal output from a reference oscillation unit including a MEMS resonator, a frequency fluctuation detector for detecting a frequency fluctuation of the MEMS resonator, and a frequency adjuster for adjusting a frequency of the local oscillation signal based on the frequency fluctuation detected by the frequency fluctuation detector. This synthesizer can output a signal with a stable frequency, even when an MEMS resonator demonstrating a large fluctuation in an oscillation frequency to temperatures is used.

Synthesizer and reception device

A synthesizer including an oscillator for outputting an oscillation signal based on an output signal from a comparator, a frequency divider for dividing a frequency of an output signal from the oscillator based on control from a controller, and a temperature sensor for detecting an error between a preset frequency and a frequency based on a reference oscillation signal. The comparator compares an output signal from the frequency divider with an output signal from a MEMS oscillator and outputs a signal indicating the comparison result to the oscillator. The controller changes the frequency division ratio of the frequency divider based on an output signal from the temperature sensor and changes the frequency division ratio in a state in which the frequency division ratio is kept at the past value. Thus, phase noise deterioration in the synthesizer can be suppressed.

Synthesizer, synthesizer module, and reception device and electronic device using same

A synthesizer includes: a synthesizer unit that outputs an oscillation signal based on a reference oscillation signal; a temperature detecting unit that detects a temperature; a time variation detecting unit that detects a time variation in frequency of the reference oscillation signal based on a result of temperature detection by the temperature detecting unit; and a control unit that adjusts a frequency of the oscillation signal outputted from the synthesizer unit based on a result of detection by the time variation detecting unit. With such a configuration, frequency compensation control is performed on a transducer having a large temperature coefficient.

Synthesizer and reception device and electronic device using the same

A synthesizer of the present invention includes a synthesizer section that generates an oscillation signal based on a reference oscillation signal output from a MEMS resonator and inputs the oscillation signal to a frequency converter; and a control section that adjusts a frequency of the oscillation signal output from the synthesizer section. In frequency adjustment by the control section, when a frequency adjustment unit of the synthesizer section is defined as predetermined value F in which quality of an output signal from the frequency converter is a quality limit threshold value, frequency adjustment unit &#x394;fcont of the synthesizer section is within predetermined value F.

Synthesizer and reception device using the same

An oscillator unit is configured such that a frequency adjustment unit of a synthesizer used by a controller is smaller than a frequency variation tracking capability of a demodulator connected to an output side of a frequency converter. This structure successfully combines the temperature compensation control of an oscillator unit and the receiving process of a high-frequency receiving device. Accordingly, an oscillator unit with large temperature coefficient is applicable to high-frequency receiving devices.

Oscillator, and receiving device and electronic device using the oscillator

A method for measuring electric circuit parameters of a 2-terminal circuit having first and second terminals, includes steps of: terminating one of the first and second terminals with a terminal impedance Z, to measure reflection characteristics &#x3b1;for the other terminal; terminating one of the first and second terminals with a terminal impedance Zdifferent from the terminal impedance Z, to measure reflection characteristics &#x3b1;for the other terminal; terminating one of the first and second terminals with a terminal impedance Zdifferent from the terminal impedances Zand Z, to measure reflection characteristics &#x3b1;for the other terminal; and calculating electric circuit parameters of the 2-terminal circuit based on the resultant reflection characteristics &#x3b1;and &#x3b1;, whereby measuring electric circuit parameters, such as S-parameters, Z-parameters or the like, even of a DUT having a weak ground, in a simple way with high accuracy and low cost.

Method and apparatus for measuring electric circuit parameters

An electronic component includes a substrate; a piezoelectric material layer supported directly or indirectly by the substrate; a first electrode arranged on a surface of the piezoelectric material layer on an opposite side of the substrate; and a second electrode arranged on a surface of the piezoelectric material layer on the substrate side. The piezoelectric material layer is sandwiched between the first electrode and the second electrode. The first electrode has a smaller surface area than the piezoelectric material layer. A portion where the piezoelectric material layer is exposed from the first electrode includes a portion that is thinner than a thickness of the piezoelectric material layer between the first electrode and the second electrode. Thus, it is possible to configure a resonator with a higher frequency than its ordinary resonance, and it is easy to achieve an adjustment of the resonance frequency of the resonator, as well as improving the yield of the component and enabling the configuration of an electronic component that includes a plurality of resonators of different frequencies.

Method for manufacturing an electronic component

A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave device comprises a piezoelectric substrate, a function region formed of comb-like electrodes for exciting surface acoustic wave provided on a main surface of the piezoelectric substrate, a space formation member covering the function region, a plurality of bump electrodes provided on a main surface of the piezoelectric substrate and a terminal electrode provided opposed to the main surface of piezoelectric substrate. The bump electrode and the terminal electrode are having a direct electrical connection, and a space between piezoelectric substrate and terminal electrode is filled with resin. When the above-configured acoustic wave device is applied for a frequency filter, a resonator, in a portable telephone unit, a keyless entry or the like communication apparatus, the overall size of such apparatus can be reduced and a higher reliability is implemented.

Method for manufacturing surface acoustic wave device

Electronic component and method for manufacturing the same

A surface acoustic wave (SAW) device having improved moisture resistance is provided. The device includes a piezoelectric substrate, an interdigital transducer (IDT) electrode on a first surface of the piezoelectric substrate, and a resin coating for covering the IDT electrode. After a piece of resin material of the resin coating is dipped in an amount of pure water as solvent having a mass as 10 times great as the piece of resin material at 120&#xb0; C. under 2 atom pressure for twenty hours, a concentration of chlorine ion in the solvent is not higher than 50 ppm.

Surface acoustic wave (SAW) device

Surface acoustic wave device, method for manufacturing, and electronic circuit device

An electronic component includes a projection electrode to be bonded to a circuit board. The projection electrode is prevented from being contaminated or oxidized during a period from manufacturing of the electronic component until mounting of the component to the circuit board. Methods of manufacturing the electronic component and an electronic circuit device are also provided. The electronic component includes the projection electrode formed on a connection terminal on a substrate having a circuit element and a protective film for covering the circuit element and the projection electrode. The projection electrode is prevented from being contaminated or oxidized since the manufacturing of the electronic component until mounting thereof to the circuit board, and reliable bonding of the projection electrode to a connection terminal of the circuit board can be realized.

Electronic component, having projection electrodes and methods for manufacturing thereof

A variable dot ink-jet printer having an ejection flow passage with a decrease in sectional area from an ejection port toward the interior of the flow passage and up to a boundary. A draw-in part draws an ink front position in the interior of the flow passage. A push-out part pushes out the ink front position outside the flow passage. When ejecting a small ink drop, the ink front position is drawn at a place having an increase in sectional area by the draw-in part. The ink is pushed outward by the push-out part at such a speed as to exit from an edge of an area of the boundary on the ejection port side.

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Osaka, Japan

Akihiko Namba