Canon Kabushiki Kaisha

Toppan Printing Co., Ltd.

Dow Corning Toray Company, Ltd.

Mitsubishi Electric Corporation

Dupont Toray Specialty Materials Kabushiki Kaisha

Kabushiki Kaisha Toshiba

Mitsubishi Electric Home Appliance Co., Ltd.

Dupont Specialty Materials Korea Ltd.

Sony Corporation

Honda Giken Kogyo Kabushiki Kaisha

Sekisui Chemical Co., Ltd.

Studio Cube, Inc.

Arcadia Co., Ltd.

Dow Toray Co., Ltd.

Akihiko Kobayashi

Takeshi Hasegawa

Eiichi Yoshioka

Akito Hayashi

Keiko Takemata

Tomohiro Iimura

Michitaka Suto

Shunya Takeuchi

Takashi Sato

Hayato Yoshino

Kazuhiro Nishijima

Takashi Sagawa

Yasuhide Saito

Naoaki Shindo

Sawako Horie

Yoshiaki Tada

Takehide Kita

Hyunji Kang

Hiroshi Ogawa

Susumu Takahashi

Atsushi Sato

Shigeki Mori

Masanobu Yamamoto

Akira Nakanishi

Toshiyuki Kashiwagi

Masayuki Taniguchi

Akira Shiga

Toshiki Toda

Kiyoshi Osato

Hiroshi Iwase

Niro Watanabe

Kasumi Takeuchi

Futoshi Miyakawa

Sota Komae

Noboru Sasaki

Mamoru Sekiguchi

Yusuke Miyamoto

Aiko Endo

Yoshimori Yamasaki

Masahiro Kawamata

Katsunori Ohnishi

Nagahisa Matsudaira

Toshibumi Imai

Kazuhisa Hoshino

Tatsuya Morimitsu

Kiyoshi Horie

Kazuya Yabusa

Sawako Inagaki

Tsutomu Shikakubo

Yutaka Oka

Toshiro Kinoshita

Makoto Arisawa

Motoko Yoshikawa

Testuo Aizawa

Satoshi Saigo

Hai Lin

Misoon Jung

Masahiro Nishizawa

Takao Tokita

Curable silicone compositions, encapsulants including the same, and optical semiconductor devices including the encapsulants are provided herein. In an embodiment, a curable silicone composition includes: (A) an alkenyl group-containing organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) an epoxy group-containing resinous organopolysiloxane represented by Average Unit Formula (I): (RSiO)(RSiO)(RSiO)(SiO)(XO)wherein Rare independently halogen-substituted or unsubstituted monovalent hydrocarbon groups, at least two Rare alkenyl groups; Rare independently halogen-substituted or unsubstituted monovalent hydrocarbon groups or epoxy group-containing organic groups, wherein at least one Ris an epoxy group-containing organic group; X is a hydrogen atom or an alkyl group; 0≤f<1; 0<g<1; 0≤h<0.9; 0≤i<0.5; and 0<j<0.5; f+g+h+i+j=1.0; h+i>0; and j/(f+g+h+i+j)>0.05 and (D) a curing catalyst.

Curable silicone composition, encapsulant and optical semiconductor device

A curable silicone composition comprises (A) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (SiO4/2) unit, (B) a resinous organohydrogenpolysiloxane including at least two silicon atom-bonded hydrogen atoms per molecule and at least one (SiO4/2) unit, (C) a catalyst for hydrosilylation reaction, and (D) a curing reaction inhibitor. The curable silicone composition exhibits practically effective curability even at low temperatures, has a low shape deformation and shrinkage rate during curing, can be cured in a short period of time, and can form a transparent and high-hardness cured product.

A heating cooker includes a housing having an exhaust aperture; a top plate on the housing with a heating zone; a heating coil to perform induction heating to heat a heating target on the heating zone; an air-sending device; a cooling air guide having an air outlet, to guide air from the air-sending device to the air outlet; and an exhaust air guide aperture with an air passage extending from a first inlet to a first outlet. The air outlet and the exhaust aperture are aligned with each other and the air outlet of the cooling air guide and the heating coil are aligned each other, both in the front and back direction. The air outlet is arranged on a front side relative to a center of the heating coil. The air passage of the exhaust air guide has a longer length than the first outlet of the air passage.

Induction cooktop with an exhaust air guide

A curable hot-melt silicone composition exhibits excellent mechanical properties, particularly strength and extension, even when formed in a film or sheet shape. The curable hot-melt silicone composition contains (A) alkenyl group-containing organopolysiloxane having at least 2 alkenyl groups per molecule, (B) branched organohydrogenpolysiloxane having at least 2 silicon-bonded hydrogen atoms per molecule, at 0.1 to 5% by mass relative to the total mass of the composition, (C) additive represented by average unit formula (C-1), (D) hydrosilylation catalyst, and (E) silica.

Curable hotmelt silicone composition, encapsulant, film and optical semiconductor device

A cooker includes a top plate provided with a plurality of cooking zones on any of which a heating object is to be placed, a plurality of heaters each provided to a corresponding one of the plurality of cooking zones, a housing provided below the top plate and accommodating the plurality of heaters, a storage defined by a partition and provided in the housing, a door configured to cover an opening provided at the housing and communicating with the storage, and a storage case attached to the door and stored in the storage. A center of gravity of the cooker is positioned closer to a width-direction center of the housing than a width-direction end of the housing.

Cooker

A cooker includes a heating coil, a housing accommodating the heating coil, a top plate provided on the housing, a partition defining a storage in the housing and below the heating coil and including a first partition extending parallel to the top plate and a second partition extending perpendicularly to the first partition, a first facing wall facing the first partition with a gap defined between the first facing wall and the first partition, a second facing wall facing the second partition with a gap defined between the second facing wall and the second partition, a heat-insulating layer provided between the first partition and the first facing wall, and a heat-insulating layer provided between the second partition and the second facing wall, the heat-insulating layers being each made of a substance having a lower thermal conductivity than one of the first facing wall and the second facing wall.

A curable silicone composition comprising: (A) an organopolysiloxane represented by the average unit formula: (RSiO)(RSiO)(RSiO)(Rare alkyl groups, alkenyl groups, aryl groups, or aralkyl groups; Rare alkyl groups or alkenyl groups; Ris an alkyl group, aryl group, or an aralkyl group, provided that, in a molecule, at least 0.5 mol % of Rto Rare the alkenyl groups, at least one of Ris the aryl group or the aralkyl group; and x, y and z are numbers satisfying: 0.01&#x2264;x&#x2264;0.5, 0.01&#x2264;y&#x2264;0.4, 0.1&#x2264;z&#x2264;0.9, and x+y+z=1); (B) a straight-chain organopolysiloxane having at least two alkenyl groups in a molecule; (C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; and (D) a hydrosilylation reaction catalyst. A cured product exhibiting excellent dispersibility of phosphor and having crack resistance is formed.

Curable silicone composition, cured product therefrom, and optical semiconductor device

The present invention provides a curable silicone composition for forming a cured product which inhibits the discoloration of silver electrodes or a silver-plated substrate in an optical semiconductor device due to a sulfur-containing gas, the curable silicone composition comprising: (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; (C) an organic compound having an organic value of at least 175 in an organic conceptual diagram and having a specific group; and (D) a hydrosilylation reaction catalyst. In addition, the present invention provides an optical semiconductor device in which silver electrodes or a silver-plated substrate of an optical semiconductor device is sealed or covered with a cured product of the composition described above, the optical semiconductor device having excellent reliability after a sulfur resistance test.

Curable silicone composition, and optical semiconductor device

The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane represented by a specific average unit formula and having at least two alkenyl groups in a molecule, (B) an optional straight-chain organopolysiloxane having at least two alkenyl groups and not having any silicon-bonded hydrogen atoms in a molecule, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, wherein at least 80 mass % of this component comprises an organotrisiloxane represented by the formula: H(CH)SiO(CH)SiOSi(CH)H, and (D) a hydrosilylation reaction catalyst. The curable silicone composition has excellent handleability and high reactivity and forms a cured product with low gas permeability.

Curable silicone composition, cured product thereof, and optical semiconductor device

A curable silicone composition comprising: (A) an organopolysiloxane represented by the average unit formula: (RSiO)(RSiO)(RSiO)(Rare alkyl groups, alkenyl groups, aryl groups, or aralkyl groups; Rare alkyl groups or alkenyl groups; Ris an alkyl group, aryl group, or an aralkyl group, provided that, in a molecule, at least 0.5 mol % of Rto Rare the alkenyl groups, at least one of Ris the aryl group or the aralkyl group; and a, b, and c are numbers satisfying: 0.01&#x2266;a&#x2266;0.5, 0.4&#x2266;b&#x2266;0.8, 0.01&#x2266;c&#x2266;0.5, and a+b+c=1); (B) an organopolysiloxane that is different from component (A); (C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; and (D) a hydrosilylation reaction catalyst. A cured product exhibiting excellent dispersibility of phosphor and having high strength and gas barrier properties is formed.

When constructing a unit building having a middle scale or more such as especially an apartment house, a long and large size building unit capable of reducing construction period while increasing construction efficiency and being economically provided can be achieved. Detachable temporary reinforcing membersare provided on both of the short side surfaces of the building unit bodyA, respectively. The temporary reinforcing memberhas lower end portion on which a projecting portionis downwardly projected.

Building unit with temporary reinforcing members, unit building, and method for constructing unit building

In a method of floor construction in a machinery preceding conveyance area of a building, such as a nuclear power plant, a floor of the building is divided into two work zones, floor and outer wall construction is performed in one of the work zones of the divided work zones of the floor as building work, preceding carry-in articles is installed in sequence as electric/mechanic equipment installing working, and partition wall construction which is building work is performed. In the other work zone, construction work of the floor and outer walls is performed as building working during the electric/mechanic equipment installing working in the aforementioned one of the divided work zone.

Floor construction method in machinery preceding conveyance area in building

According to one embodiment, a display control device includes an area determination module, a direction determination module, and a display controller. The area determination module determines, on a touch panel having input coordinates corresponding to display coordinates of a display module, whether at least part of a touch area where a touch object touches is present in a predetermined area in a display area displaying an object displayed on the display module. The direction determination module determines a movement direction of the touch area. The display controller displays the object as being zoomed in or zoomed out based on determination results of the area determination module and the direction determination module.

Display control device and display control method

An optical disk () of the present invention has a substrate () included a resin-impregnated paper, in which resin is impregnated into paper, or resin-coated paper, in which the paper surface is coated with a resin, and a recording layer () formed on at least one side of the substrate (). This type of optical disk () has performance equal to that of conventional optical disks and has a minimal effect on the environment during disposal. In addition, a manufacturing method of an optical disk of the present invention has a recording layer sheet fabrication step in which a recording layer sheet is fabricated by forming tracks on a recording layer base material, and a recording layer sheet lamination step in which a recording layer () included the recording layer sheet is provided on a substrate () included resin-impregnated paper or resin-coated paper by laminating the recording layer sheet with the resin-impregnated paper in which a resin is impregnated into paper or the resin-coated paper in which the surface of the paper is coated with a resin. This type of manufacturing method of an optical disk allows optical disk () to be produced inexpensively.

Optical disk and its manufacturing method

A removable electronic device includes an enclosure and connector device, wherein the connector device has a connector device guide formed on each of two sides of the connector device. The enclosure has an enclosure guide, which is in a shape generally continuous with the connector device guide, formed on each of two sides thereof.

Connector and electronic device and information processing apparatus using said connector

Growing community of inventors

Tokyo, Japan

Akihiko Kobayashi