Kyocera Corporation

Akihiko Kitagawa

Takashi Kimura

Yoshiaki Itakura

An optical element mounting package includes an optical component and a base. The optical component reflects light. The base has a recess. In the recess, a first mounting portion and a second mounting portion are provided. On the first mounting portion, an optical element is to be mounted. On the second mounting portion, the optical component is mounted. The optical component includes a reflective surface and a transmission film on the reflective surface. A front surface of the transmission film is inclined relative to the reflective surface.

Mounting package for an optical element with inclined transmission film and flat mirror

An optical element mounting package includes a recess, a mounting portion for an optical element, and a reflector. The mounting portion is at a bottom surface of the recess. The reflector is, in the recess, positioned forward in an emission direction of light of the optical element. A first portion is a portion of an inner side surface of the recess, and is positioned in an opposite direction to the emission direction. The first portion has an inclined surface toward the bottom surface of the recess.

Optical element mounting package, electronic device, and electronic module

An electronic component mounting package includes: a substrate with ceramic as a base material, the substrate including a cavity having a bottom surface where an electronic component mounting part is located and an inner periphery that has a corner part and a straight part; and an inner peripheral surface where a first metal film is located, the first metal film having a thickness larger at the straight part than at the corner part on the inner periphery having a single distance from the bottom surface or the first metal film having a surface roughness larger at the straight part than at the corner part on the inner periphery having a single distance from the bottom surface.

Electronic component mounting package and electronic module

An electronic component mounting package includes: an insulating base body including a principal face and a recess which opens in the principal face; and a metallic pattern including a plurality of metallic layers lying across a side face of the recess and the principal face. The metallic pattern includes, as an inner layer, at least one metallic layer selected from a tungsten layer, a nickel layer, and a gold layer, and an aluminum layer as an outermost layer. The metallic pattern includes an exposed portion corresponding to a part of the metallic layer constituting the inner layer which part is exposed at the principal face.

Electronic component mounting package for mounting a light-emitting element, electronic device, and electronic module

There is provided a light-emitting device capable of suppressing a decrease in a light emission amount. A light-emitting device including a container member including a ceramic package provided with a depressed portion serving as a discharge space, and a light transmitting member which is attached to the ceramic package via a joining layer formed of a joining material so as to close the depressed portion; an inert gas encapsulated inside the discharge space; and a couple of discharge electrodes which are disposed in the depressed portion of the ceramic package so as to be spaced from each other, the joining material including glass exhibiting a white color, and oxide ceramic powder.

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Kyoto, Japan

Akihiko Kitagawa