Nitto-denko Corporation

Nitto Electric Industrial Co., Ltd.

Akihiko Kira

Minoru Ametani

Takao Matsushita

Keigo Funakoshi

Keizo Shirakura

A process for peeling a protective film stuck to an upper-side of a wafer is disclosed. The protective film is peeled by adhering an adhesive tape to the upper side of the rear end of said protective film stuck on the wafer by means of a press roller, lifting the press roller and sliding said press roller forward, sliding a peeling unit forward to peel the adhesive tape together with the protective film by utilizing the adhesive force of the adhesive tape. The wafer is prevented from being damaged.

Process for peeling protective film off a wafer

A device for sticking adhesive tape to thin articles, such as semiconductor wafers, and trimming excess portions of said tape from the thin articles. A plurality of sticking rollers apply adhesive tape from a roll to each thin article, the tape having an adhesive side oriented towards an upper surface of the article and a width greater than a width of the article. A suction stage receives and holds each of the thin articles with the adhesive tape stuck thereto by said sticking rollers while a tape cutter trims the excess portion of the tape from along peripheral edge portions of the article. A tape peeling device then peels off the trimmed excess portions of the tape from the thin article, whereupon the thin article is conveyed back to a cassette.

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Osaka, Japan

Akihiko Kira