Murata Manufacturing Co., Ltd.

Akihiko Kamada

Norio Sakai

Isao Kato

Tadashi Nomura

Issei Yamamoto

Nobuaki Ogawa

Yoichi Takagi

Tsuyoshi Saitoh

Yoshikatsu Nakayama

Jun Adachi

Hidekiyo Takaoka

Hideo Nakagoshi

Mitsuhiro Matsumoto

Masaaki Mizushiro

Issey Yamamoto

Kosuke Nakono

Kensei Nishida

In a method of manufacturing a module board, an electronic component is mounted on a first principal surface of a small board. A cavity defining a through hole is formed in a core board. The electronic component is housed in the cavity by mounting the small board on a surface electrode arranged around the cavity. Resin layers are formed on both principal surfaces of the core board, and resin flows through a gap between the core board and the small board. Hence, the inside of the cavity is filled with the resin, and the electronic component is sealed with the resin.

Module board and manufacturing method thereof

An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating substrate in contact with the resin layer, the contact surface forming the side surface of the connecting component.

Module and method of manufacturing the same

A plating layer of a Cu-M-based alloy (M represents Ni and/or Mn) is formed on an end surface of a connection terminal member at an exposed side, the Cu-M-based alloy being capable of generating an intermetallic compound with an Sn-based low-melting-point metal contained in a bonding material forming a bonding portion and having a lattice constant different from that of the intermetallic compound by 50% or more. In the reflow process, even if the bonding material is about to flow out by re-melting thereof, since the bonding material is brought into contact with the Cu-M-based plating layer, a high-melting-point alloy of the intermetallic compound is formed so as to block the interface between the connection terminal member and the resin layer.

Electronic component module

A low profile module is provided that has a high functionality achieved by increasing the component mounting density. In spite of achieving high functionality in a moduleby respectively mounting components such as a semiconductor substrateand chip componentson the two main surfacesandof a wiring substrate, the low-profile modulecan be provided which has a high functionality as a result of increasing its component mounting density by forming a thickness Ha of a first component layerformed by mounting only the semiconductor substrateface down on one main surfaceof the wiring substrateso as to be smaller than the thickness of a second component layerformed by mounting a plurality of chip componentson the other main surfaceof the wiring substrate

Low profile semiconductor module with metal film support

A module includes a circuit board, a resin layer, an external connection conductor, a solder bump. The resin layer is disposed on a first principal surface of the circuit board. The external connection conductor is arranged in the resin layer, has a first end connected to the circuit board and a second end protruding through the surface of the resin layer and includes a projection extending along the surface of the resin layer in a portion that protrudes through the surface of the resin layer. The solder bump is disposed on the second end of the external connection conductor.

An ESD protection device is constructed such that its ESD characteristics are easily adjusted and stabilized and degradation of discharge characteristics caused by repetitive discharges is reliably prevented. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least a pair of discharge electrodes including exposed portions arranged to face each other and to be exposed in the cavity, external electrodes provided on a surface of the insulating substrate and connected to the discharge electrodes, and a conductive material dispersed along at least a portion of an inner circumferential surface which defines the cavity between the exposed portions of the discharge electrodes, the conductive material including an anchor portion embedded in the insulating substrate.

ESD Protection Device

A multilayer interconnection board includes a plurality of laminated ceramic layers. Wiring electrodes are disposed on principal surfaces of the ceramic layers, and dot patterns are arranged around the wiring electrodes. The dot patterns are arranged such that the density distribution thereof is varied such that the ratio of the presence of the dot patterns in the vicinity of the wiring electrode is relatively large and the ratio of the presence is reduced as the distance from the wiring electrode increases.

Multilayer interconnection board

A method for forming circuit patterns having different resistances. The method includes (1) a first step of forming a first toner image using a first toner and a second toner image using a second toner, each by electrophotography, the first toner containing a resistive material, the second toner having a resistance different from that of the first toner; and (2) a second step of transferring and fixing the first toner image and the second toner image to an object to be printed such as a ceramic green sheet, to form a circuit pattern.

Method for forming circuit pattern

A circuit-forming charging powder allowing circuit patterns to resist being peeled off a printing object when the powder is used for printing a circuit pattern by an electrophotographic method on the object, wherein the circuit-forming charging powder has a conductive metal powder, a charge control agent and an adhesion reinforcing agent combined with a heat-melt resin and a method for producing the circuit-forming charging powder, as well as printed objects and multilayer wiring boards are described.

Circuit-forming charging powder and multilayer wiring board using the same

It is an object of the present invention to provide a method of manufacturing ceramic electronic parts, with a reduced manufacturing time and a reduced manufacturing cost so as to be suitable for manufacturing many kinds or types of electronic parts but requiring only a small number of production steps. The method of producing ceramic electronic parts comprises a first process of printing an amount of electrified powder for forming a ceramic layer on a carrier member which is a film consisting of a polyethylene terephthalate (PET), so as to form a desired ceramic layer; a second process of printing an amount of electrified powder for forming internal electrodes on the ceramic layer, so as to form desired electrode patterns which will later be formed into desired internal electrodes; a third process of printing an amount of electrified powder for forming another ceramic layer on the above ceramic layer and the above electrode patterns, so as to form another desired ceramic layer.

Method of manufacturing ceramic electronic parts

An electrophotographic apparatus including a photosensitive member; a corona charger for charging a surface of the photosensitive member; a circuit-forming/chargeable powder supplying device for supplying circuit-forming/chargeable powder to a latent image pattern on the photosensitive member; a transferring device for transferring the circuit-forming/chargeable powder on the latent image pattern onto a ceramic green sheet; a flash lamp for fixing the circuit-forming/chargeable powder, transferred onto the ceramic green sheet, in order to form a circuit pattern (not shown) on the ceramic green sheet; and a circuit pattern forming position recognizing camera for detecting a circuit pattern forming position on the ceramic green sheet. In the electrophotographic apparatus, laser beams are used to form a predetermined latent image pattern (not shown) on a surface of the photosensitive member. Even when the electrophotographic apparatus is used for forming a circuit pattern on a print material by an electrophotographic method, the problem that a circuit pattern forming position shifts does not occur.

Electrophotographic apparatus

Provided is a production method and a production apparatus for a ceramic green sheet, capable of achieving a thin layer without using an aqueous or organic solvent. The method of producing a ceramic green sheet includes a first step of charging a carrier sheet, a second step of attaching chargeable powder charged in the polarity opposite to that of the carrier sheet, on the surface of the carrier sheet by electrostatic force, and a third step of applying heat to the chargeable powder attached on the surface of the carrier sheet by electrostatic force so as to fix the chargeable powder onto the surface of the carrier sheet.

Production method for ceramic green sheet

Before ceramic green sheets formed on carrier films, which are prepared for manufacturing a ceramic multilayer circuit board, are stacked with each other, each carrier film is separated from each ceramic green sheet, which is maintained in a state being attracted by an attracting head. This separation is rendered to gradually extend over the entire region from an end of the ceramic green sheet.

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Yasu, Japan

Akihiko Kamada