Mitsui Chemicals, Inc.

Akihiko Iwashita

Masahiko Okamoto

Kyoko Kobayashi

Motoyasu Yasui

Ryohei Shiga

Yoshisada Fukagawa

An adhesive resin composition including a propylene polymer (A), an ethylene polymer (B), and a thermoplastic resin (C) including a copolymer containing not less than 60 mol % and not more than 99 mol % of structural units derived from 4-methyl-1-pentene, and not less than 1 mol % and not more than 40 mol % of structural units derived from a C2-C20 α-olefin other than 4-methyl-1-pentene, these structural units representing total 100 mol % of the copolymer, the thermoplastic resin (C) showing a melting point Tm of not more than 199° C. or showing substantially no melting point as analyzed with a differential scanning calorimeter (DSC). The total of the components (A), (B) and (C) includes 45 to 75 parts by mass of the component (A), 5 to 20 parts by mass of the component (B), and 15 to 45 parts by mass of the component (C).

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Harrison, NY, United States of America

Akihiko Iwashita