Stanley Electric Co., Ltd

Akihiko Hanya

Kosaburo Ito

Reiki Tada

Yasuhiro Tada

Hiroto Fukushima

Norifumi Imazeki

Hiroyuki Chikama

Takuya Yamamoto

Tsukasa Imura

Haruna Minami

Marino Mine

Yoshiyuki Abe

Toshihiko Minoda

Shoko Kasai

Provided is an on-vehicle illumination device which is compact, does not have a space therein, and is capable of realizing a complex curved surface shape. The on-vehicle illumination device includes a light-emitting element disposed on a wiring pattern on a substrate, and an outer lens layer made of a resin and mounted on the light-emitting element. The substrate has a shape curved along a curvature of the outer lens layer in a front-rear direction.

On-vehicle illumination device and production method therefor

A laminated film in which a heat-resistant base film and a metal foil are bonded using an adhesive is provided with a barrier layer that prevents chemicals from entering the adhesive layer, between the metal foil and the adhesive layer. The barrier layer is made of a heat-resistant resin similar to that of the base film and has a water absorption rate of 1% or less. The adhesive layer is a silicone-based resin and has a thickness of 40 &#x3bc;m or more after drying.

Laminated film, light-emitting device using the same, and method for manufacturing light-emitting device

An aspect of the invention provides a multilayer circuit substrate that has a simple configuration and is thin. The multilayer circuit substrate has a stacked multiple of substrates and a wiring pattern disposed so to be sandwiched between the stacked multiple of substrates. At least one portion of the wiring pattern is configured of a conductive material wherein conductive particles are sintered. An upper face of the wiring pattern is directly joined to the substrate positioned above the wiring pattern, a lower face of the wiring pattern is directly joined to the substrate positioned below the wiring pattern, and the stacked multiple of substrates are fixed to each other by the wiring pattern.

Multilayer circuit substrate and manufacturing method thereof

The present invention provides a panel capable of switching between a state transparent to external light, a point light emitting state, and a surface light emitting state. Provided is a transparent panel provided with light emitting function, including: an LED die; a light transmitting substrate for LED, on which the LED die is mounted; a wiring pattern provided on a surface of the light transmitting substrate for LED and bonded to the LED die; and a light diffusing panel laminated on the light transmitting substrate for LED. The light diffusing panel includes: a pair of light transmitting substrates for liquid crystal; a liquid crystal layer sandwiched between the pair of light transmitting substrates for liquid crystal; and transparent conductive films disposed on the light transmitting substrates for liquid crystal, and is switchable between a transparent state and a light diffusion state.

Transparent panel provided with light emitting function

Provided is a circuit board for reducing a likelihood of so-called through-hole disconnection, and enhancing connection reliability on both sides of a substrate via a through-hole. The circuit board has a substrate with the through-hole, a first conductive part covering an opening of the through-hole on one surface of the substrate in a manner blocking the opening, having a portion inserted into the through-hole from the one surface, and a second conductive part covering a second opening of the through-hole on the other surface of the substrate in a manner blocking the second opening, having a portion inserted into the through-hole from the other surface. The portion of the first conductive part inserted in the through-hole has a columnar shape forming a columnar portion having a diameter smaller than the through-hole. The portion of the second conductive part inserted in the through-hole has a shape that fills a gap between the columnar portion of the first conductive part and an inner surface of the through-hole. Both of the first and the second conductive parts comprise conductive particles being sintered.

Circuit board, electronic circuit device, and production method of circuit board

Provided is an electronic device capable of supplying large current to a circuit pattern, without employing a thick film structure for the circuit pattern. The electronic device includes a substrate, a wiring layer placed on the upper surface of the substrate, an electronic component mounted above the wiring layer, and a bonding layer placed between the electronic component and the wiring layer. The wiring layer and the bonding layer are porous layers containing pores. The bonding layer has higher volume density than the wiring layer except underneath the electronic component.

Electronic device and production method thereof

A vehicular lamp fitting comprising a film light source that includes a transparent film having flexibility, and a plurality of semiconductor light-emitting elements which are fixed in a state of being two-dimensionally disposed on at least a front surface of the transparent film; and a reflection surface that is disposed in a state of facing a rear surface of the transparent film of the film light source, and that reflects light which is emitted from a part or all of the plurality of semiconductor light-emitting elements and transmitted through the transparent film.

Vehicular lamp fitting

Provided is a vehicular lamp which has a novel lighting appearance and satisfies a light distribution standard required by certain laws as well as being capable of realizing lighting patterns of various luminances and various light-emitting shapes, e.g., various lighting graphics. The vehicular lamp is provided with a film light source including a film having flexibility and a plurality of semiconductor light-emitting elements fixed in a state of being two-dimensionally disposed on at least a surface of the film.

Vehicular lamp

An object of the present invention is to provide a composition for sintering capable of suppressing a crack from occurring in a wiring after sintering. Provided is the composition for sintering including silver nanoparticles, an organic dispersant for coating the silver nanoparticles, and a solvent. When the composition for sintering is heated, a weight loss rate in a range of 260&#xb0; C. to 600&#xb0; C. is 2.92% or less.

Composition for sintering, method for producing silver nanoparticles, circuit board, and method for manufacturing circuit board

Provided is a sheet for drawing user's eyes and guiding the line of sight. A visual line guidance sheet is arranged to cover at least a part of a window for a user to look out therethrough, and configured to guide the user's line of sight, by illuminating a partial region on the visual line guidance sheet. The visual line guidance sheet includes an optically transparent substrate layer, a plurality of LED dies, and a wiring pattern. The controller receives from an imager, an image obtained by imaging a region visible by the user through the window, detects an object targeted for visual line guidance, included in the image, and illuminates the LED dies on the visual line guidance sheet, corresponding to a position of the object.

Visual line guidance sheet, visual line guidance system, vehicle lighting apparatus, and vehicle

Provided is an optically transparent plate having a structure where an LED die is directly mounted on an optically transparent substrate, and light extraction efficiency is improved. The optically transparent plate comprises, an optically transparent substrate, a wiring pattern placed on either of a surface on the upper side and a surface on the underside of the optically transparent substrate, or on both of the surfaces, and the LED die bonded to the wiring pattern. A reflective layer is placed on the other side, of the surface of the optically transparent substrate on which the LED die is mounted. At least a part of the wiring pattern and at least a part of the reflective layer comprise a conductive material obtained by sintering conductive particles.

Optically transparent plate with light emitting function and method of producing the same

A resistor manufacturing method includes a first step of applying a solution wherein conductive nanosized particles with a particle diameter of less than 1 &#x3bc;m and an insulating material are at least dispersed, or a solution wherein the conductive nanosized particles covered with an insulating material layer are at least dispersed, in a desired form on a substrate surface, thereby forming a film. The resistor manufacturing method also includes a second step of irradiating one portion of the film with light in a predetermined pattern, and sintering the conductive nanosized particles with the light, thereby forming a resistive film that is a conductive particle layer of the predetermined pattern.

Resistor production method, resistor, and electronic device

An electronic device capable of supplying a large current to a circuit pattern containing conductive nanoparticles includes a substrate, a region provided on the substrate, configured to mount an electronic component therein, a first circuit pattern placed within the region and electrically connected to the electronic component, a second circuit pattern connected to the first circuit pattern and configured to supply current to the first circuit pattern from outside of the region. At least a part of the first circuit pattern includes a layer obtained by sintering conductive nanosized particles with a diameter of less than 1 &#x3bc;m. The second circuit pattern is thicker than the first circuit pattern.

Electronic device, method for producing same, and circuit substrate

A light-emitting device having a plurality of light-emitting elements closely adjacently disposed in spite of using only one substrate is provided. One or more light-emitting elements are flip-chip mounted on each of upper surface and lower surface of a substrate. The light-emitting elements are disposed so that the light-emitting elements on the upper surface of the substrate and the light-emitting elements on the lower surface of the substrate are closely adjacent to each other when they are seen from above the substrate. The light-emitting elements mounted on the upper surface of the substrate have light-emitting surfaces as the upper surfaces, and the light-emitting elements mounted on the lower surfaces of the substrate have light-emitting surfaces on the substrate side. The substrate transmits at least lights emitted by the light-emitting elements mounted on the lower surface of the substrate.

Semiconductor light-emitting device and method for producing the same

A thin light-transmitting substrate showing high thermal conduction efficiency, and having a function of raising surface temperature thereof is provided. The light-transmitting substrate of the present invention comprises a substrate that transmits at least a light of a predetermined wavelength, and a conductor pattern that is disposed on the substrate, and generates heat to raise temperature of the surface of the substrate when it is supplied with an electric current. The conductor pattern is directly disposed on the substrate without any adhesive layer.

Growing community of inventors

Tokyo, Japan

Akihiko Hanya