Fujitsu Corporation

Akihiko Fujisaki

Junichi Ishimine

Masahiro Suzuki

Haruhiko Yamamoto

Masahiro Miyo

Jie Wei

Tetsuyuki Kubota

Yoshiaki Udagawa

Makoto Sakairi

Hisashi Kawashima

Masahiro Mochizuki

Sachiko Furuya

Keizo Takemura

Masumi Suzuki

Shunichi Kikuchi

Yosuke Tsunoda

Minoru Hirano

Hidehisa Sakai

Nobuyoshi Yamaoka

Atsushi Furuya

Tomoko Kutsuzawa

Hitoshi Nori

Hisao Anzai

Hideo Katsumi

Kazuhisa Inagaki

Takamasa Shinde

Jie Wie

An electronic device includes a board having a first surface on which a heating element is mounted, a heat sink plate disposed to face the first surface of the board, and a heat pipe disposed between the board and the heat sink plate such that one end of the heat pipe is disposed at a position where the one end is in contact with the heating element, and the other end of the heat pipe is disposed to be in contact with the heat sink plate, wherein the heat sink plate has a stacking structure of a first heat sink plate of which a front surface faces the board, and a second heat sink plate disposed on a rear surface of the heat sink plate, and a through hole is formed at a position on the first heat sink plate.

Electronic device

A disclosed setting method includes: in response to an instruction to replace a first component with a second component, determining whether or not data that correlates a surface of the first component with a surface of a third component has been set; upon determining that the data that correlates the surface of the first component with the surface of the third component has been set, extracting a surface of the second component, which corresponds to the surface of the first component; and correlating the extracted surface of the second component with the surface of the third component instead of the surface of the first component in the data.

Setting method and information processing apparatus

A mesh number prediction method obtains a mesh length for a case in which a mesh having an arbitrary shape is created by approximating an entire analyzing target by a three-dimensional (3D) mesh model based on data of a 3D surface model of the analyzing target, obtains a mesh number of each part forming the analyzing target for a case in which a mesh having an arbitrary shape is created by approximating each part by a 3D mesh model based on the mesh length, and obtains a predicted total mesh number of the entire analyzing target from a ratio of volumes of the entire analyzing target and each part based on the mesh number.

Mesh number prediction method, analyzing apparatus and computer-readable storage medium

A magnet unit for a magnetron sputtering system includes a base plate and a plurality of magnet parts each including a first magnet and a first supporting member. The first supporting member supports the first magnet and fixes the first magnet to the base plate. The magnet parts confine a plasma.

Magnet unit for magnetron sputtering system

In a semiconductor device cooling apparatus which cools a semiconductor device uniformly with a simple structure, a coolant is supplied from a supply port to the center of a heat transmission plate on which a semiconductor device is disposed in intimate contact therewith, is radially flown toward the peripheral edge portion of the heat transmission plate through a gap-shaped flow path which is formed by a gap forming plate composed of two thin plate members of a gap interval plate acting as a spacer and a gap top plate disposed on the gap interval plate and has a small height, is collected by a collection groove formed around the peripheral edge portion, and is discharged from a discharge port.

Semiconductor device cooling apparatus

An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

Liquid-cooled electronic apparatus

A dehumidifier includes a circular rotor accommodating a humidity absorbing material, a disc member provided on each one of two circular end surfaces of the rotor and having a diameter identical to or greater than a diameter of the rotor, and a plurality of openings formed in the disc members, wherein the rotor rotates through a dehumidification zone and a recycle zone formed by a dividing plate disposed so as to project from each one of the disc members, the rotor circulating a first flow of air of relatively high humidity through the dehumidification zone so as to dehumidify and recycle the first flow of air, the rotor circulating a second flow of air of relatively low humidity through the recycle zone so as to dehumidify the humidity absorbing material. The openings in the disc members have an identical substantially fan shape and are disposed so as to radiate from a center of the disc member, thus exposing the humidity absorbing material accommodated therein. The dehumidifier further includes a strip member made of a flexible material disposed between the dividing plate and the disc member so as to form a seal between the dehumidification zone and the recycle zone, preventing leakage of air from one zone into the other and thus improving dehumidification.

Rotor-type dehumidifier, starting method for rotor-type dehumidifier and an electronic device mounting the rotor-type dehumidifier

A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.

Semiconductor element cooling apparatus

In a cooling structure for cooling circuit element modules that are mounted on a circuit board and has heat sinks, there are provided a main duct to which the circuit element modules are connected, and a coolant supplying device which is connected to the main duct and supplies a coolant to the main duct.

Cooling structure for integrated circuit element modules, electronic

A cooling system for an electronic device includes a circulatory system having a pump with an inlet and an outlet for circulating a coolant in the circulatory system, a heat exchanger for cooling the coolant, a cooling module for cooling the electronic device by the coolant and a tank for reserving the coolant which is connected to the circulatory system via inflow and outflow bypass channels. The inflow bypass channel is connected to the circulatory system at a first connection node between the pump outlet and the cooling module. The outflow bypass channel is connected to the circulatory system at a second connection node between the cooling module and the pump inlet.

Cooling system for electronic device

A cooling system comprising an airtight box which accommodates a cooling module and an electronic device which is cooled by the cooling module and has a door which is opened when attending to maintenance of parts within the airtight box, a dew condensation preventing unit for absorbing humidity within the airtight box and/or replacing air or gas within said airtight box when operated, a coolant supply unit for recirculating a coolant between the coolant supply unit and the cooling module, and a controller for operating the coolant supply unit and the dew condensation preventing unit in response to a first instruction signal which instructs a cooling operation, and for heating the electronic device in response to a second instruction signal which instructs the maintenance of the parts within the airtight box, where only one of the first and second instruction signals exists at one time. The controller includes a circuit part responsive to the second instruction signal for supplying an operating signal to the electronic device to operate the electronic device for a predetermined time, so that the electronic device rises to a predetermined temperature due to heat generated by the electronic device itself.

Growing community of inventors

Kawasaki, Japan

Akihiko Fujisaki