Growing community of inventors

Berlin, Germany

Akif Özkök

Average Co-Inventor Count = 7.72

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 3

Akif ÖzkökBert Reents (3 patents)Akif ÖzkökHorst Brüggmann (3 patents)Akif ÖzkökMarko Mirkovic (3 patents)Akif ÖzkökSoungsoo Kim (2 patents)Akif ÖzkökThomas Schiwon (2 patents)Akif ÖzkökHerwig Josef Berthold (2 patents)Akif ÖzkökMarcin Klobus (2 patents)Akif ÖzkökHeiko Brunner (1 patent)Akif ÖzkökWolfgang Dahms (1 patent)Akif ÖzkökSven Lamprecht (1 patent)Akif ÖzkökUdo Grieser (1 patent)Akif ÖzkökKai-Jens Matejat (1 patent)Akif ÖzkökThomas Moritz (1 patent)Akif ÖzkökMarkus Youkhanis (1 patent)Akif ÖzkökOlanda Grieser, Legal Representative (1 patent)Akif ÖzkökChristopher Grieser, Legal Representative (1 patent)Akif ÖzkökMustafa Özkök (1 patent)Akif ÖzkökAkif Özkök (4 patents)Bert ReentsBert Reents (7 patents)Horst BrüggmannHorst Brüggmann (5 patents)Marko MirkovicMarko Mirkovic (3 patents)Soungsoo KimSoungsoo Kim (5 patents)Thomas SchiwonThomas Schiwon (4 patents)Herwig Josef BertholdHerwig Josef Berthold (2 patents)Marcin KlobusMarcin Klobus (2 patents)Heiko BrunnerHeiko Brunner (23 patents)Wolfgang DahmsWolfgang Dahms (17 patents)Sven LamprechtSven Lamprecht (9 patents)Udo GrieserUdo Grieser (8 patents)Kai-Jens MatejatKai-Jens Matejat (7 patents)Thomas MoritzThomas Moritz (4 patents)Markus YoukhanisMarkus Youkhanis (4 patents)Olanda Grieser, Legal RepresentativeOlanda Grieser, Legal Representative (3 patents)Christopher Grieser, Legal RepresentativeChristopher Grieser, Legal Representative (3 patents)Mustafa ÖzkökMustafa Özkök (2 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Atotech Deutschland Gmbh & Co. Kg (3 from 13 patents)

2. Atotech Deutschland Gmbh (1 from 288 patents)


4 patents:

1. 12439528 - Method of preparing a high density interconnect printed circuit board including microvias filled with copper

2. 12245383 - Method of preparing a high density interconnect printed circuit board including microvias filled with copper

3. 12063751 - Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board

4. 7872130 - Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit

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as of
12/5/2025
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