Kaneka Corporation

Sekisui Chemical Co., Ltd.

Aki Koukami

Kazuo Hagiwara

Keisuke Oguma

Keigo Oowashi

Kouji Ashiba

Kazuhide Fujimoto

Rui Zhang

The problem to be solved by the invention is to provide a laminate capable of effectively enhancing thermal conductivity and adhesiveness, in spite of the relatively large thickness of a patterned metal layer. The laminate () according to the present invention includes a metal substrate (), an insulating layer () laminated on one surface of the metal substrate (), and a patterned metal layer () laminated on the surface of the insulating layer () on the side opposite to the metal substrate (), the metal layer () is 300 &#x3bc;m or more in thickness, and the insulating layer () includes boron nitride () and an inorganic filler () other than boron nitride.

Laminate and electronic device

The present invention provides a heat dissipation structure that does not cause problems such as contact failures in electronic components and that is applicable to electronic components with high heat densities. The present invention also provides a method for easily repairing an electronic device. The heat dissipation structure is obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W/cmto 500 W/cmis mounted, the thermally conductive curable resin composition containing a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23&#xb0; C. of 30 Pa&#xb7;s to 3000 Pa&#xb7;s and a thermal conductivity of 0.5 W/(m&#xb7;K) or more, and being curable by moisture or heat.

Heat dissipation structure

A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.

Heat dissipating structure

Growing community of inventors

Osaka, Japan

Aki Koukami