Zf Friedrichshafen Ag

Ake Ewald

Stefan Hain

Michael Sperber

An inverter includes at least one phase and two driver boards situated opposite each other, and at least one half-bridge, arranged between the driver boards and contacted electrically and/or by signals, with, in each case, a semiconductor package formed as a high-side switch and a semiconductor package arranged parallel thereto and formed as a low-side switch. A heat sink in the region of the half-bridges and connected to a cooling attachment under each semiconductor package, wherein the heat sink has a split design so that a first cooling branch is arranged in the high-side branch and a second cooling branch is arranged in the low-side branch, wherein the cooling branches are arranged at a distance from each other, and the cooling branches are fluidically interconnected in parallel or in series in a region outside the arrangement of the semiconductor packages.

Inverter structure of an inverter of a power electronics module for operating an electric drive of a motor vehicle

An inverter has at least one current phase along a first axis and an input-side current connection for each phase, for receiving a DC input current. The phase(s) output AC output current generated from the DC input current, which is generated by a semiconductor bridge circuit. An intermediate circuit connected in parallel to the bridge circuit has at least one capacitor and heat sink between the intermediate circuit and the bridge circuit. The bridge circuit lies on the heat sink. The bridge circuit has at least one half bridge for each phase, formed by a high side switch and an opposing low side switch, connected in parallel, and each of the phases is located between the associated high and low side switches and on the heat sink, and each high and low side switch is electrically connected directly to the respective phase via a first electrical contact connection.

Inverter structure of an electronic module for an electric drive of a vehicle

A power module for operating an electric vehicle drive, comprising: numerous semiconductor components; a heatsink for discharging heat generated by the semiconductor components; a DC link capacitor connected in parallel to the semiconductor components; a DC link line electrically connecting the DC link capacitor to the semiconductor components; wherein the DC link line is at least partially located in a hole formed in the heatsink.

Power module for operating an electric vehicle drive with improved temperature determination of the power semiconductors

A power module for operating an electric vehicle drive may include one or more of the following: a plurality of semiconductor components; an intermediate circuit capacitor connected in parallel to the semiconductor components; a heatsink for the removal of heat generated by the semiconductor components, where the heatsink is located between the semiconductor components and the intermediate circuit capacitor; and an intermediate circuit line that electrically connects the intermediate circuit capacitor to the semiconductor components. The intermediate circuit line may extend perpendicular to a direction of flow for the coolant in the heatsink on a side of the semiconductor components facing away from the heatsink.

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Bayreuth, Germany

Ake Ewald