Honeywell International Inc.

Ajit Yadav

Murali Krishna Bezawada

John Boettger

Murali Thavva V V

A packaged cellular modem system includes a capacitor for receiving power from a DC power source, a DC-to-DC converter coupled to capacitor electrodes, a cellular modem coupled to the converter output and to an antenna, and an IS barrier circuit coupled to a modem output. A microcontroller coupled to a boost regulator has its output coupled to electrodes. A metrology jumper is between the microcontroller and ground. An encapsulation material provides a potted area for the capacitor, converter, modem, IS barrier circuit and microcontroller. A SIM card is coupled to the modem by the IS barrier circuit. LED's are coupled to the microcontroller. The SIM card and LEDs are in a non-potted area. A transparent SIM card access cover over the SIM card and LEDs enables exposing the SIM card.

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Hyderabad Telangana, India

Ajit Yadav