Asm Technology Singapore Pte Ltd

Ajit Gaunekar

Gang Ou

Gary Peter Widdowson

Ka Shing Kenny Kwan

Tin Kwan Bobby Chan

Dongsheng Zhang

Yun Bo He

Dong Sheng Zhang

A wire bonding apparatus, comprising a bonding tool mounted on a bondhead body which is in turn mounted on a positioning table, is provided for bonding electronic devices. The positioning table has first and second motors coupled to it that are operative to drive the bondhead body to positions along respective first and second orthogonal axes. The bondhead body is connected to the positioning table through a pivot such that the bondhead body is rotatable relative to the positioning table about a third axis which is substantially orthogonal to the first and second axes. Further, a third motor drives the bondhead body to rotate about the third axis.

Wire bonding apparatus comprising rotary positioning stage

A direct drive robotic manipulator is provided which includes a plurality of segments that are rotatably coupled with respect to one another. A plurality of spindles connects the segments for relative rotation therebetween, and a plurality of direct drive assemblies is further coupled to the plurality of spindles. Each direct drive assembly encloses an end of a spindle and comprises a rotor assembly to which the spindle is attached for manipulating the spindle. A positional measurement apparatus may also be included at each direct drive assembly to ascertain an angular disposition of a segment relative to an adjoining segment.

Direct drive robotic manipulator

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Singapore, Singapore

Ajit Gaunekar