Freescale Semiconductor,inc.

Ajay Singhal

Terry Grant Sparks

Kirk J Strozewski

A semiconductor fabrication method that includes forming a film () comprising an imaging layer () and an under layer () over a semiconductor substrate (). The imaging layer () is patterned to produce a printed feature () having a printed dimension (). The under layer () is then processed to produce a sloped sidewall void () in the under layer () wherein the void () has a finished dimension () in proximity to the underlying substrate that is less than the printed dimension. Processing the under layer () may include exposing the wafer to high density low pressure Nplasma.

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Round Rock, TX, United States of America

Ajay Singhal