Kla Tencor Corporation

Sugarcrm Inc.

Intuit, Inc.

Paypal, Inc.

Kla-tencor Technologies Corporation

Kla Corporation

Ajay Gupta

Mohan Mahadevan

Majed Itani

Thanh Huy Ha

Jacob Taylor

Allen Park

Sankar Venkataraman

Hedong Yang

Chien-Huei Adam Chen

John Roberts

Clinton Oram

Ashok V Kulkarni

Brian Duffy

Jason Kirkwood

Chien-Huei (Adam) Chen

Michael John Van Riet

Grigoriy E Kesler

Songnian Rong

Roger Smith

Joseph Parsons

Naoshin Haque

Aleksandr Matiushkin

Julian Ostrow

Govind Thattaisundaram

Richard Wallingford

Kenong Wu

Eugene Shifrin

Jan A Lauber

Laurent Karsenti

Lila Alexei Tretikov

Peter Francis White

Christopher Maher

Ben Kneen

Mike Van Riet

Jianwei Wang

Yair Carmon

Olivier Moreau

Yun-Ping Hsu

Hai Jiang

Sadek Baroudi

Andrew Dreisch

Kaustubh (Kaust) Namjoshi

Michael Cook

Sashi Balasingam

Ernesto Escorcia

Andy Dreisch

Vineet Dhyani

Kumar Raja

Udy Danino

Noga Bullkich

Collin Lee

Andrew Wu

Rob Aagaard

Adam Chien-Huei Chen

Michael Van Riet

Certain aspects of the present disclosure provide techniques for enumerating relationships in an object graph using traversal context objects that are decoupled from the implementation details of an object graph and the objects stored therein. An example method generally includes receiving a request to traverse an object graph, the object graph including a plurality of objects. A root context object is generated, and a traversal context object associated with a root node of the object graph is generated. The traversal context object is linked to the root context object and added to a traversal data structure. The graph is traversed by adding and removing traversal context objects to and from the traversal data structure until a terminating event occurs.

Method and system for traversing an object graph using traversal context objects

Methods and systems for providing weak pattern (or hotspot) detection and quantification are disclosed. A weak pattern detection and quantification system may include a wafer inspection tool configured to inspect a wafer and detect defects present on the wafer. The system may also include at least one processor in communication with the wafer inspection tool. The at least one processor may be configured to: perform pattern grouping on the detected defects based on design of the wafer; identify regions of interest based on the pattern grouping; identify weak patterns contained in the identified regions of interest, the weak patterns being patterns deviating from the design by an amount greater than a threshold; validate the weak patterns identified; and report the validated weak patterns or facilitate revision of the design of the wafer based on the validated weak patterns.

Computer assisted weak pattern detection and quantification system

Real-time job distribution software architectures for high bandwidth, hybrid processor computation systems for semiconductor inspection and metrology are disclosed. The imaging processing computer architecture can be scalable by changing the number of CPUs and GPUs to meet computing needs. The architecture is defined using a master node and one or more worker nodes to run image processing jobs in parallel for maximum throughput. The master node can receive input image data from a semiconductor wafer or reticle. Jobs based on the input image data are distributed to one of the worker nodes. Each worker node can include at least one CPU and at least one GPU. The image processing job can contain multiple tasks, and each of the tasks can be assigned to one of the CPU or GPU in the worker node using a worker job manager to process the image.

Semiconductor inspection and metrology systems for distributing job among the CPUs or GPUs based on logical image processing boundaries

Methods and systems for providing weak pattern (or hotspot) detection and quantification are disclosed. A weak pattern detection and quantification system may include a wafer inspection tool configured to inspect a wafer and detect defects present on the wafer. The system may also include at least one processor in communication with the wafer inspection tool. The at least one processor may be configured to: perform pattern grouping on the detected defects based on design of the wafer; identify regions of interest based on the pattern grouping; identify weak patterns contained in the identified regions of interest, the weak patterns being patterns deviating from the design by an amount greater than a threshold; validate the identified weak patterns; and report the validated weak patterns or facilitate revision of the design of the wafer based on the validated weak patterns.

Methods and systems for determining parameter(s) of a metrology process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for automatically generating regions of interest (ROIs) to be measured during a metrology process performed for the specimen with the measurement subsystem based on a design for the specimen. The computer subsystem(s) are also configured for automatically determining parameter(s) of measurement(s) performed in first and second subsets of the ROIs during the metrology process with the measurement subsystem based on portions of the design for the specimen located in the first and second subsets of the ROIs, respectively. The parameter(s) of the measurement(s) performed in the first subset are determined separately and independently of the parameter(s) of the measurement(s) performed in the second subset.

Automated pattern fidelity measurement plan generation

Methods and systems for determining parameter(s) of a process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for determining an area of a defect detected on a specimen. The computer subsystem(s) are also configured for correlating the area of the defect with information for a design for the specimen and determining a spatial relationship between the area of the defect and the information for the design based on results of the correlating. In addition, the computer subsystem(s) are configured for automatically generating a region of interest to be measured during a process performed for the specimen with a measurement subsystem based on the spatial relationship.

Self directed metrology and pattern classification

A business software application system and method are provided that include a feed system for distributing changes about the application/module to a group of users and a cloud connector system that links external data sources to the business software application system and method.

Business software application system and method

Systems and methods for profiling a user include providing a user account to a user and, in response, storing a user account identifier in association with the user account in a database. First user data is then received that is associated with the user account identifier and that includes activity associated with the user account, and the first user data is association with the user account in the database. Subsequent user data is then received that includes information about the user and that is associated with additional user identifiers and the user account identifier and, in response, the additional user identifiers are association with the user account identifier and each other in the database, and the additional user data is associated with the user account in the database. A user profile may then be creating using the first user data, the second user data, and the third user data.

Multi-identifier user profiling system

Methods and systems for detecting defects in patterns formed on a specimen are provided. One system includes one or more components executed by one or more computer subsystems, and the component(s) include first and second learning based models. The first learning based model generates simulated contours for the patterns based on a design for the specimen, and the simulated contours are expected contours of a defect free version of the patterns in images of the specimen generated by an imaging subsystem. The second learning based model is configured for generating actual contours for the patterns in at least one acquired image of the patterns formed on the specimen. The computer subsystem(s) are configured for comparing the actual contours to the simulated contours and detecting defects in the patterns formed on the specimen based on results of the comparing.

Contour based defect detection

Methods and systems for determining overlay error between different patterned features of a design printed on a wafer in a multi-patterning step process are provided. For multi-patterning step designs, the design for a first patterning step is used as a reference and designs for each of the remaining patterning steps are synthetically shifted until the synthetically shifted designs have the best global alignment with the entire image based on global image-to-design alignment. The final synthetic shift of each design for each patterning step relative to the design for the first patterning step provides a measurement of relative overlay error between any two features printed on the wafer using multi-patterning technology.

Determining multi-patterning step overlay error

A hierarchical tagging system and method are provided. In one embodiment, a software-based customer relationship management system and method may include the hierarchical tagging system.

Customer relationship management system with hierarchical tagging

One embodiment relates to a method of inspecting an array of cells on a substrate. A reference image is generated using a cell image that was previously determined to be defect free. A reference contour image which includes contours of the reference image is also generated. The reference contour image is used to detect defects in the array of cells on the substrate. Another embodiment relates to a system for detecting defects in an array on a substrate. Other embodiments, aspects and features are also disclosed.

Contour-based array inspection of patterned defects

Various embodiments for determining parameters for wafer inspection and/or metrology are provided.

Data perturbation for wafer inspection or metrology setup using a model of a difference

Growing community of inventors

Cupertino, CA, United States of America

Ajay Gupta