Agency for Science, Technology and Research

Ajay Agarwal

Janak Singh

Chih Kiong Terence Gan

Xiaolin Zhang

Rakesh Kumar

Navab Singh

Narayanan Balasubramanian

Rama Krishna Kotlanka

Ramana Murthy Badam

Levent Yobas

Xiang Jie Cyrus Foo

Ieng Kin Lao

A probe element and a method of forming a probe element are provided. The probe element includes a carrier comprising biodegradable and/or bioactive material; and at least one electrode coupled to the carrier.

Probe element and method of forming a probe element

A method of fabricating a sensor comprising a nanowire on a support substrate with a first semiconductor layer arranged on the support substrate is disclosed. The method comprises forming a fin structure from the first semiconductor layer, the fin structure comprising at least two supporting portions and a fin portion arranged there between; oxidizing at least the fin portion of the fin structure thereby forming the nanowire being surrounded by a first layer of oxide; and forming an insulating layer above the supporting portions; wherein the supporting portions and the first insulating layer form a microfluidic channel. A nanowire sensor is also disclosed. The nanowire sensor comprises a support substrate, a semiconducting fin structure arranged on the support substrate, the fin structure comprising at least two semiconducting supporting portions and a nanowire arranged there between; and a first insulating layer on a contact surface of the supporting portions; wherein the supporting portions and the first insulating layer form a microfluidic channel.

Nanowire sensor, nanowire sensor array and method of fabricating the same

In a 3D free space micromirror device, a mirror plate is joined with actuators through flexible springs where the other ends of the actuators have fixed support on the substrate. Single crystal silicon and aluminum are used as bi-morph materials with silicon dioxide providing electrical isolation between the two. Thickness variation in the microstructure is achieved by two-step p-n junction formed in a p-type substrate. Thick and thin n-silicon layer formation and DRIE cut mechanisms are employed in such a way that all the thick and thin silicon components of the structure are released simultaneously avoiding overetch which can be detrimental to the thin flexural springs. Working prototypes of the device have been found suitable for any optical switching array architecture where deflections up to 10 degrees are required.

Single-crystal-silicon 3D micromirror

First and second n-doped regions are formed at a surface of a p-doped single crystal silicon substrate. An aluminum layer is patterned overlying some of the second n-doped regions to form thermal actuators. A dielectric layer is deposited overlying the patterned aluminum layer and an underlying thermal oxide layer. A metal layer is deposited thereover and patterned to form bond pads to the thermal actuators and to form reflecting mirror surfaces overlying others of the second n-doped regions to form micromirrors. The substrate is etched away from the backside stopping at the first and second n-doped regions. Then the wafer is diced into mirror array chips. Portions of the first n-doped regions are etched away from the frontside to form flexible springs wherein the second n-doped regions covered by the patterned aluminum layer form thermal actuators and wherein the flexible springs connect the micromirrors to the thermal actuators.

Method of making a single-crystal-silicon 3D micromirror

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Singapore, Singapore

Ajay Agarwal