Intel Corporation

Aiswarya M Pious

Navneet Kumar Singh

Tarakesava Reddy Koki

Konika Ganguly

Min Suet Lim

George Vergis

Bill Nale

Jaejin Lee

Samarth Alva

Bijendra Singh

Richard S Perry

Samantha Rao

Vinaya Kumar Chandrasekhara

Jagadish Vasudeva Singh

Phani Kumar Alaparthi

Nirmala Bailur

James Panakkal

Amarjeet Kumar

Gaurav Hada

Vinay Kumar Chandrasekhara

Mallari Hanchate

Antonio Shiu Kee Cheng

Sushil Padmanabhan

Raji James

Siva Prasad Jangili Ganga

Raghavendra S Kanivihalli

Particular embodiments described herein provide for a tablet computer that can be configured to include a display, an antenna, a plurality of capacitance-based proximity sensors, and a configuration engine. The configuration engine uses the capacitance-based proximity sensors to determine a configuration of the tablet computer when the tablet computer is attached to an accessory. The capacitance-based proximity sensors can be specific absorption rate (SAR) proximity sensors used to determine when to reduce radiation from one or more antenna when the tablet computer is not coupled to the accessory and to determine a configuration of the tablet computer when the tablet computer is coupled to an accessory.

Tablet and tablet cover with configuration detection

An air mover external to a mobile computing device provides enhanced cooling to the device by generating forced air delivered to the device via cooling channels connected to openings in the device chassis. If the mobile computing device is passively cooled (is a fanless device), the enhanced cooling can enable the device or device components to operate at a higher power consumption level without exceeding device/component thermal limits or for features that consume high amounts of power (e.g., fast charging) to be incorporated into the device. The air mover can be integrated into or attached to a cable that provides power to the mobile computing device. The air mover can be powered by the cable. The air mover can dynamically adjust the flow rate of the forced air based on device/component performance information (temperature, power consumption, current consumption) or operational state information of the device.

External cooling solution for mobile computing devices

A connector to connect an electronic module to an edge of a first electronic circuit board is described. The module has a second electronic circuit board. The connector has a top part that houses a first row of I/Os. The top part is to be placed on a surface of the first electronic circuit board. The connector has a bottom part that houses a second row of I/Os. The bottom part is to be placed on an opposite surface of the first electronic circuit board, wherein, the top and bottom parts form inner and outer stand-offs when mater together. The inner stand-off is to reside within a through hole of the first electronic circuit board. The outer stand-off is to reside within free space off the edge of the first electronic circuit board. The second electronic circuit board is to be pressed in between the first row of I/Os and the second row of I/Os when the module is connected to the connector.

Memory module connector for thin computing systems

Embodiments described herein may be related to apparatuses, processes, and techniques related to EMI shielding and thermal conduction without using any surface area of a PCB. Embodiments of the EMI shield may include a planar top, with one or more walls extending from the planar top to a bottom surface of the PCB, the PCB having a top surface disposed between the bottom surface of the PCB and the planar top. A ground of the PCB may electrically couple with the one or more walls. The bottom of the walls may couple with an EMI gasket applied to a bottom chassis to increase the volume of EMI shielding. Other embodiments may be described and/or claimed.

Electromagnetic interference shielding enclosure with thermal conductivity

Examples described herein relate to a device that includes: a first power rail to provide a signal from a power source to a reference supply voltage pin of a memory controller; a second power rail to provide a signal from the power source to an output buffer pin of the memory controller and to an output buffer pin of a central processing unit (CPU). In some examples, the second power rail is separate from the first power rail, during a high power state, the power source is to supply a same voltage to each of the reference supply voltage pin, the output buffer pin of the memory controller, and the output buffer pin of the CPU, and during a connected standby state, the power source is to reduce voltage provided to the output buffer pin of the memory controller and the output buffer pin of the CPU using the second power rail and maintain a voltage provided to the reference supply voltage pin.

Power control of a memory device in connected standby state

Techniques and mechanisms for determining a delivery of power by a programmable power supply. In an embodiment, controller circuitry of a platform receives an indication that a load of the platform is to transition to a particular operational mode. Based on a power requirement of the operational mode, the controller circuitry identifies a mode of voltage regulation which is to be provided with converter circuitry of the platform. The controller circuitry signals that a programmable power supply, which is coupled to the platform, is to output a supply voltage at a level which is based on an amount of power loss associated with the mode of voltage regulation. In another embodiment, the controller circuitry identifies the mode of voltage regulation based on an amount of charge which is currently stored by a battery of the platform.

Device, method and system for programming a power supply to facilitate dynamic performance tuning

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Bengaluru, India

Aiswarya M Pious