International Business Machines Corporation

Globalfoundries Inc.

Aimin Xing

Ming Cai

Woo-Hyeong Lee

Murshed Mahmud Chowdhury

Chandra Reddy

Embodiments of the present invention provide an improved method for forming transistor contacts. A sacrificial layer is deposited in a first set of contact cavities, and a capping layer is formed on the sacrificial layer. This protects the first set of contact cavities during formation of a second set of contact cavities. The sacrificial layer is then removed, and the first and second sets of contact cavities are filled with a conductive material.

Method of forming transistor contacts

A first liner and a second liner are formed such that a peripheral portion of the second liner overlies a peripheral portion of the first liner. A photoresist layer is applied and patterned such that a sidewall of a patterned photoresist layer overlies an overlapping peripheral portion of the second liner An isotropic dry etch is performed to laterally etch the overlapping peripheral portion of the second liner from below the patterned photoresist layer. The patterned photoresist is subsequently removed, and a structure without an overlap of the first and second liners is provided.

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Fishkill, NY, United States of America

Aimin Xing