Ngk Insulators, Inc.

Aiko Otsuka

Shuichi Ichikawa

Takashi Harada

Yasushi Noguchi

Atsushi Kaneda

Yukihisa Wada

Takuma Makino

Yoshinori Yamamoto

Motomichi Itou

Masashi Marada

The method for measurement of thermal conductivity of a honeycomb structure according to the present invention comprises the steps keeping the whole honeycomb structure in a steady temperature state with keeping two ends of the honeycomb structure at given different temperatures; and measuring a thermal conductivity of the honeycomb structure in the steady state. According to the present invention there is provided a method for measurement of thermal conductivity of a honeycomb structure, which can measure the thermal conductivity of a honeycomb structure in the shape of the honeycomb structure per se or in a predetermined block shape without preparing, for example, a test specimen of particular shape.

Method of measuring thermal conductivity of honeycomb structure

A method of manufacturing a honeycomb structure. (1) Water is added to silicon carbide particles and kneaded into a kneaded raw material. The silicon carbide particles have an average particle diameter of not less than 2 &#x3bc;m and not more than the honeycomb rib thickness&#xd7;0.23 and a logarithmic standard deviation of the particle size distribution of not less than 0.15 and not more than 0.40 (step S). (2) The kneaded raw material is extruded by extrusion into a honeycomb extruded body (step S). (3) The extruded body is dried (step S), calcined (step S), and fired (step S).

Method of manufacturing honeycomb structure and silicon carbide particle for manufacturing the same

There is provided a method for manufacturing a silicon carbide based honeycomb structure, the method using, as a part of a starting material, a recycled raw material recycled from a recovered material generated in a process for manufacturing the silicon carbide based honeycomb structure and derived from a starting material for a silicon carbide based honeycomb structure; wherein the recycled raw material is pulverized to have an average particle size of 10 to 300 &#x3bc;m. According to the present invention, structure defects such as voids or coarse particles, which have been problems upon manufacturing a silicon carbide based honeycomb structure, are hardly formed, and a silicon carbide based honeycomb structure having excellent strength and uniform heat conductivity can be obtained. In addition, since a once kneaded material is used as a part of a starting material, the time for kneading can be shortened.

Method for manufacturing silicon carbide based honeycomb structure and silicon carbide based honeycomb structure

A method for producing a porous ceramic article involves a step of kneading raw materials including a raw material for a ceramic and a processing aid, to prepare a body, a step of forming the body, to prepare a ceramic formed product, a step of drying the formed product, to prepare a ceramic dried article, and a step of firing the ceramic dried article, to preparing a porous ceramic article, characterized in that the processing aid is a starch having been subjected to a crosslinking treatment or a material comprising a starch having been subjected to a crosslinking treatment and a foamed resin. The method allows the production of a porous ceramic article which is suppressed in the deformation during drying and is excellent in dimensional accuracy.

Method for producing porous ceramic article

A honeycomb structurehas a large number of through-holesdivided by partition wallsand extending in the axial direction, characterized in that the honeycomb structure contains a Si phase having a lattice constant controlled at 0.54302 to 0.54311 nm at room temperature. A process for producing the honeycomb structure, includes a firing step of firing a precursor of honeycomb structure, wherein the precursor contains a Si phase and the firing step is conducted using a furnace material free from any boron-containing compound. A process for producing the honeycomb structure, includes a firing step of firing a precursor of honeycomb structure, wherein a reduction percentage of Si content in Si phase after firing step relative to Si content in Si phase before firing step is suppressed at 10% by mass or less. Having an improved thermal conductivity, the honeycomb structure is superior in thermal shock resistance.

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Okazaki, Japan

Aiko Otsuka