Semiconductor Components Industries, LLC

Aik Chong Tan

Chee Hiong Chew

Michael John Seddon

James Price Letterman, Jr

Brian A Webb

Albert J Laninga

Boon Huat Lim

Saat Shukri Embong

Kenneth Teik Kheong Low

Chee Chuan Chew

Santhiragasen Al Sengram Pillay

Chong Un Tan

Shan Chong Tan

A lead frame with a plurality of bump terminals is provided. Stamping an indentation into each lead in the lead frame forms the bump terminals. The bump terminals will be used as contact points in a completed semiconductor device.

Bump chip lead frame and package

A lead frame for the assembly of thin small outline packages incorporating a semiconductor circuit is provided in a generally rectangular form including a plurality of conductive leads opposing one another about the longitudinal sides of the lead frame and a die mounting portion centered therebetween. In addition, a pair of leads is provided at the distal ends of the lead frame which are stamped in a general &ldquo;S&rdquo; shape. These stamped leads extend downwardly from the lead frame and are within the footprint of the lead frame. The footpads of these additional leads remain exposed as the lead frame is encapsulate in a plastic molded package and are level with the bottom of the molded package.

Lead frame for assembly for thin small outline plastic encapsulated packages

A semiconductor package ( ) with a die ( ) having die pads ( ) coupled to inner ends ( ) of interconnects ( ), the die ( ) and the interconnects ( ) are molded in mold compound ( ) with mounting surface ( ) and outer ends ( ) exposed. A semiconductor die has an interconnect surface opposite the mounting surface.

Semiconductor package and method for forming same

Growing community of inventors

Johor Bahru, Malaysia

Aik Chong Tan