Sharp Kabushiki Kaisha Corporation

Osaka University

Aiji Suetake

Masahiro Hasegawa

Hiroshi Yokota

Katsuaki Suganuma

Hiroya Sato

Seiichiro Kihara

Yuji Yano

Jinting Jiu

Tomotoshi Satoh

Shijo Nagao

Shigeru Yasukawa

Provided is an electrode like a protruding electrode that is self-standing on a substrate. A conductive paste () contains a conductive powder, an alcoholic liquid component, and no adhesives. The conductive powder contains conductive particles having a thickness of 0.05 &#x3bc;m or more and 0.1 &#x3bc;m or less and a representative length of 5 &#x3bc;m or more and 10 &#x3bc;m or less, the representative length being a maximum diameter in a plane perpendicular to the direction of the thickness. The weight percentage of the alcoholic liquid component relative to the conductive paste is 8% or more and 20% or less.

Conductive paste having dilatancy, electrode connection structure including the paste, and method for producing the structure

An optical element module according to the present invention includes a plurality of optical elements laminated therein, each optical element including: an optical surface at a center portion thereof; and a spacer section having a predetermined thickness on an outer circumference side of the optical surface, wherein an adhesive is positioned on a further outer circumference side of the spacer section, and the upper optical element and the lower optical element are adhered to each other such that an inside and an outside of the adhesive are ventable through a ventilating section of the adhesive.

Optical element wafer module, optical element module, method for manufacturing optical element module, electronic element wafer module, method for manufacturing electronic element module, electronic element module and electronic information device

An electronic element wafer module is provided, in which a transparent support substrate is disposed facing a plurality of electronic elements formed on a wafer and a plurality of wafer-shaped optical elements are disposed on the transparent support substrate, where a groove is formed along a dicing line between the adjacent electronic elements, penetrating from the optical elements through the transparent support substrate, with a depth reaching a surface of the wafer or with a depth short of the surface of the wafer; and a light shielding material is applied on side surfaces and a bottom surface of the groove or is filled in the groove, and the light shielding material is applied or formed on a peripheral portion of a surface of the optical element, except for on a light opening in a center of the surface.

Electronic element wafer module and method for manufacturing electronic element wafer module, electronic element module and method for manufacturing electronic element module, and electronic information device

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Osaka, Japan

Aiji Suetake