Alpha Omega Semiconductor Inc.

Alpha and Omega Semiconductor (cayman) Ltd.

Aihua Lu

Yan Xun Xue

Hamza Yilmaz

Jun Lu

Ming-Chen Lu

Yan Huo

Lei Shi

A semiconductor device with thick bottom metal comprises a semiconductor chip covered with a top plastic package layer at its front surface and a back metal layer at its back surface, the top plastic package layer surrounds sidewalls of the metal bumps with a top surface of the metal bumps exposing from the top plastic package layer, a die paddle for the semiconductor chip to mount thereon and a plastic package body.

Semiconductor device with thick bottom metal and preparation method thereof

A die attach method for a semiconductor chip with a back metal layer located at the back surface of the semiconductor chip comprises the steps of forming a bonding ball array including a plurality of bonding balls with a same height on a die attach area at a top surface of a die paddle; depositing a die attach material in the bonding ball array area with a thickness of the die attach material equal or slightly larger than the height of the bonding ball; attaching the semiconductor chip to the die attach area at the top surface of the die paddle by the die attach material, wherein the bonding ball array controls the bond line thickness of the die attach material between the back metal layer and the top surface of the die paddle and prevents the semiconductor chip from rotating on the die attach material when it is melted.

Method of using bonding ball array as height keeper and paste holder in semiconductor device package

Growing community of inventors

Shanghai, China

Aihua Lu