Hewlett-packard Development Company, L.p.

Ai-Tsung Li

Kuan-Ting Wu

Kevin Voss

Shih-Han Chen

Hung-Wen Chang

Michael J Delpier

Wei-Chung Chen

Chao-Wen Cheng

Ya-Ting Yeh

Wei Kuang Chu

An example system can include a noise sensor communicatively coupled to a controller of a computing device to dynamically determine a sound pressure level (SPL) of an environment in which the computing device is present. The computing device can include a cooling fan and the controller comprising a processor in communication with a memory resource including instructions executable to dynamically determine a threshold speed of the cooling fan based on the determined SPL of the environment set a speed of the cooling fan based on the determined threshold speed.

Cooling fan and noise sensor

Examples herein relate to fan bodies with pressure regulating chambers. For instance, in some examples a fan body can define an outlet, an inlet, a fan chamber that is in fluidic communication with the inlet and the outlet, and a hollow pressure regulating chamber having an opening that is in fluidic communication with the fan chamber.

Fan bodies with pressure regulating chambers

In example implementations, an apparatus is provided. The apparatus includes an accelerometer, a plurality of fan blades, a coil magnet and a processor. The accelerometer is coupled to a motor to measure an amount of vibration. The plurality of fan blades is coupled to the motor. Each one of the plurality of fan blades comprises a magnet. The coil magnet is coupled to a fan housing that encloses the motor, the plurality of fan blades and the accelerometer. The processor is communicatively coupled to the motor, the accelerometer, and the coil magnet. The processor activates the coil magnet to control a balance of the plurality of fan blades in response to an amount of vibration measured by the accelerometer that exceeds a threshold.

Magnetic fan blade controls

Example implementations relate to multilayer housings. In one example, multilayer housing can include a first continuous layer comprising copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof, a void layer on the first continuous layer, wherein the void layer comprises from (5) volume percent (vol. %) to (95) vol. % voids; and a second continuous layer on the void layer, wherein the second continuous layer comprises copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof.

Multilayer housings

Examples of a cover for a device are described herein. The cover includes a substrate to be placed in proximity of a heat source of a device. In an example, a heat resistant layer is applied over a surface of the substrate to insulate heat generated by the heat source. Further, a top layer is applied over one of the heat resistant layer and another surface of the substrate, which is opposite to the surface having the heat resistant layer. The top layer provides at least one of chemical resistant properties and aesthetic properties.

Growing community of inventors

Taipei, Taiwan

Ai-Tsung Li