Infineon Technologies Ag

National Semiconductor Corporation

Ai Min Tan

Gerald Ofner

Mary Teo

Subodh Gautam Mhaisalkar

Carlo Marbella

Ganesh Vetrivel Periasamy

Kok Kiat Koo

Swain Hong Yeo

Sarvotham M Bhandarkar

Pei Siang Lim

Bernard K H Lee

Emillo F Mallare, Jr

Ben T C Tan

In accordance with an embodiment, a semiconductor package includes a first surface configured to be mounted on a circuit board, and a region of thermally expandable material configured to push the first surface of the semiconductor package away from the circuit board when a temperature of the thermally expandable material exceeds a first temperature.

System and method for an electronic package with a fail-open mechanism

An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an electrically conductive inductor coil for magnetically aligning the semiconductor chip with the rewiring substrate.

Magnetically alignable integrated circuit device

A semiconductor chip includes flip chip contacts that are arranged on contact surfaces of an active top side of the semiconductor chip. The contact surfaces are surrounded by a passivation layer that covers the active top side while leaving exposed the contact surfaces. The passivation layer includes thickened portions that surround the contact surfaces. The semiconductor chip formed with thickened portions around the contact surfaces is protected from delamination during packaging of the semiconductor chip to form a semiconductor device.

Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip

Improved structures for and methods for assembling heatspreader attachments in integrated circuit packages permit attachment of a relatively low cost heatspreader having a high coefficient of thermal expansion directly to the back of a die while maximizing thermal performance, mechanical integrity and reliability of the assembly. The improvements are realized through the use of specific adhesive materials to attach the heatspreader to the die, heatspreader geometries, adhesive geometries, assembly techniques and underfill geometries.

Method and structure for heatspreader attachment in high thermal performance IC packages

Growing community of inventors

Singapore, Singapore

Ai Min Tan