Taiwan Semiconductor Manufacturing Comp. Ltd.

Ai-Jen Jung

Wei-Liang Lin

Chien-Wei Wang

Ko-Bin Kao

Chia-Hsiang Lin

Jui-Ching Wu

Methods for forming a pattern in a lithography process for semiconductor wafer manufacturing are provided. In an example, a method includes forming a photoresist layer over a material layer; performing a first exposure process on the photoresist layer, thereby forming an exposed photoresist layer having soluble portions and unsoluble portions; treating the exposed photoresist layer, wherein the treating includes one of performing a second exposure process on the exposed photoresist layer and forming an adsorbing chemical layer over the exposed photoresist layer; and developing the exposed and treated photoresist layer to remove the soluble portions of the photoresist layer, wherein the unsoluble portions of the photoresist layer form a photoresist pattern that exposes portions of the material layer.

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Zhushan, Taiwan

Ai-Jen Jung