Micron Technology Incorporated

Ai-Chie Wang

Chin Hui Chong

Choon Kuan Lee

Wuu Yean Tay

Teck Kheng Lee

Voon Siong Chin

Pre-encapsulated lead frames suitable for use in microelectronic device packages are disclosed. Individual lead frames can include a set of multiple lead fingers arranged side by side with neighboring lead fingers spaced apart from each other by a corresponding gap. An encapsulating compound at least partially encapsulates the set of lead fingers without encapsulating a microelectronic device. The encapsulating compound can generally fill the plurality of gaps between two adjacent lead fingers.

Pre-encapsulated lead frames for microelectronic device packages, and associated methods

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side.

Growing community of inventors

Singapore, Singapore

Ai-Chie Wang