Samsung Electronics Co., Ltd.

Dongwoo Fine-chem Co., Ltd.

Techno Semichem Co., Ltd.

Dongwoo Fine-chem

Ahn-Ho Lee

Seung-Hyun Ahn

Shi-Jin Sung

Sang-tae Kim

Dong-Min Kang

Sang-Kyun Kim

Yong-il Kim

Jung-Min Choi

Yong-Sik Yoo

Go-Un Kim

Junghun Lim

Chung-Kyung Jung

Kyong-ho Lee

Young Taek Hong

Sang-Tae Kim

Seonghwan Park

Seunghyun Ahn

Dong-jin Kim

Baiksoon Choi

Baik-Soon Choi

Jin-Seok Yang

Kyong-Ho Lee

Hyuntak Kim

Dong-Hun Kang

Byungil Lee

Young-Chul Jung

Yu-Ri Jung

A thinner composition including an acetate-based compound in an amount in a range of about 30 weight percent to about 70 weight percent, a lactate-based compound in an amount in a range of about 1 weight percent to about 20 weight percent, a propionate-based compound in an amount in a range of about 30 weight percent to about 60 weight percent, and an ether-based additive in an amount in a range of about 10 ppm to about 500 ppm, based on a total amount of the composition.

Thinner compositions

A cleaning composition includes an organic solvent, an organic acid, a chelating agent, a surfactant containing at least one hydroxyl group (OH) at the end, and an ultra pure water, wherein a pH value of the cleaning composition is equal to or higher than 12.

Cleaning composition after chemical mechanical polishing of organic film and cleaning method using the same

In a thinner composition and a method of forming a photosensitive film, the thinner composition includes about 50 to about 90% by weight of propylene glycol monomethyl ether acetate, about 1 to about 20% by weight of propylene glycol monomethyl ether, about 1 to about 10% by weight of &#x3b3;-butyrolactone, and about 1 to about 20% by weight of n-butyl acetate. The thinner composition may have a proper volatility and an improved ability to dissolve various types of photosensitive materials, and thus the thinner composition may be usefully employed in an edge bead rinse process, a rework process or a pre-wetting process.

Methods of forming a photosensitive film

A photosensitive-resin remover composition includes an amine compound and de-ionized water, an amount of the de-ionized water being about 45% to about 99% by weight based on a total weight of the composition.

Photosensitive-resin remover composition and method of fabricating semiconductor device using the same

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Yongin-si, South Korea

Ahn-Ho Lee