Corning Incorporated

Ah-Young Park

Vikram Bhatia

Yousef Kayed Qaroush

Prantik Mazumder

Scott Christopher Pollard

Chukwudi Azubuike Okoro

Rajesh Vaddi

Mandakini Kanungo

Neng Wang

Chad Byron Moore

Zheming Zheng

Tian Huang

Ekaterina Aleksandrovna Kuksenkova

Navaneetha Krishnan Subbaiyan

Zhang Liu

According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

Hermetic metallized via with improved reliability

A cold-formed glass laminate () may include a first ply () of 3D formed glass with a first thickness, a first strength, and a first coefficient of thermal expansion. The laminate () may also include a second ply () of 3D formed glass with a second thickness less than the first thickness, a second strength greater than the first strength, and a second coefficient of thermal expansion. The second coefficient of thermal expansion may be selected to be sufficiently higher than the first coefficient of thermal expansion to induce residual compressive stresses in the first ply () due to cold forming therewith. An adhesive layer () may be arranged between the first ply () and the second ply ().

Edge strength using CTE mismatch

A cold-formed glass laminate may include a first ply of 3D formed glass with a first thickness and a first strength. The first ply may include pre-formed residual compressive stresses in a peripheral edge portion adapted to offset tensile stresses resulting from a cold-forming process. The laminate may also include a second ply of 3D formed glass with a second thickness less than the first thickness and a second strength greater than the first strength. An adhesive may be arranged between the first ply and the second ply and post-formed residual stresses in the peripheral edge portion of the first ply of the laminate may remain compressive. A method of forming a glass laminate with compressive edge stresses is also described.

Edge stress using differential cooling

Articles and methods related to the cold-forming of glass laminate articles utilizing stress prediction analysis are provided. A cold-forming estimator (CFE) value that is related to the stress experienced by a glass sheet of a glass laminate during cold-forming is calculated based on a plurality of geometric parameters of glass layer(s) of a glass laminate article. The calculated CFE value is compared to a cold-forming threshold related to the probability that defects are formed in the complexly curved glass laminate article during cold-forming. Cold-formed glass laminate articles are also provided having geometric parameters such that the CFE value is below the cold-forming threshold.

Cold-formability of glass laminate article utilizing stress prediction analysis and related methods

According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 &#x3bc;m at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 &#x3bc;m at the second major surface and fully fills the via between the first cavity and the second cavity.

According to various embodiments, an article including a glass or glass-ceramic substrate having a first major surface and a second major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length, L, the via defining a first axial portion, a third axial portion, and a second axial portion disposed between the first and third axial portions. The article further includes a helium hermetic adhesion layer disposed on the interior surface in the first and/or third axial portions and a metal connector disposed within the via, the metal connector being adhered to the helium hermetic adhesion layer. The metal connector fully fills the via over the axial length, L, the via has a maximum diameter, &#x3a6;, of less than or equal to 30 &#x3bc;m, and the axial length, L, and the maximum diameter, &#x3a6;, satisfy an equation: 

Hermetic fully-filled metallized through-hole vias

An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0&#xd7;10atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of &#x2212;40&#xb0; C. and heating the article to a temperature of 125&#xb0; C., and the article has a helium hermeticity of less than or equal to 1.0&#xd7;10atm-cc/s after 100 hours of HAST at a temperature of 130&#xb0; C. and a relative humidity of 85%.

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Daejeon, South Korea

Ah-Young Park