Samsung Electronics Co., Ltd.

Ah-Young Kim

Yoo-Sang Hwang

Yong Seok Choi

Hyeong-sun Hong

Gyo-young Jin

Jay-Bok Choi

Ye-Ro Lee

Choul Jun Hwang

Byung Min Jung

Hyeung Wook Park

Jong Deok Lim

Ka-Ei Kim

The reusable packaging box includes a bottom unit that has a receiving space in which a product may be received, a lower body and an upper body that are provided to each have a box shape with open top and bottom to be coupled to a top of the bottom unit, and a lid that has a receiving space in which the product may be received and is coupled to the top of the upper body. Each of the bottom unit, the upper body and the lower body, and the lid is formed of a material that may absorb an impact and thus may perform both a function of absorbing an impact and a function of packaging an outside of the product.

Reusable packaging box

A method of fabricating a semiconductor device comprises forming a first and a second parallel field regions in a substrate, the parallel field regions are extended in a first direction, forming a first and a second gate capping layer in a first and a second gate trench formed in the substrate respectively, removing the gate capping layers partially so that a first landing pad hole is expanded to overlap the gate capping layers buried in the substrate partially, forming a landing pad material layer in the first space, and forming a bit line contact landing pad by planarizing the landing pad material layer to the level of top surfaces of the capping layers.

Methods of fabricating semiconductor devices having buried channel array

Growing community of inventors

Seongnam-si, South Korea

Ah-Young Kim