Microview Technologies Pte Ltd

Saedge Vision Solutions Pte. Ltd.

Ah Kow Chin

Victor Vertoprakhov

Soon Wei Wong

Tian Poh Yew

Noor Ashedah Binti Jusoh

Wong Su Wei

Zhou Wensen

Choong Fatt Ho

Chee Leong Chua

There is provided an apparatus and method for inspecting a semiconductor package. The apparatus includes at least one 3D camera positioned at a first angle relative to a normal axis of the semiconductor package; and a light source configured to provide illumination for the at least one 3D camera, the light source being directed at the semiconductor package. The method includes casting a shadow of a bonded wire onto the semiconductor package; obtaining a 3D image of the semiconductor package; determining a distance S of the shadow and the bonded wire in the image; and obtaining a wire loop height H of the bonded wire.

Apparatus and method for inspecting a semiconductor package

A method of optically inspecting a fastener to determine whether it meets two or more dimensional parameters is provided. The method includes using centrifugal force to place the fastener in a predetermined location. Two or more sets of image data of the fastener are generated from two or more corresponding different angles. Fastener pass/fail data is generated using a dimensional requirement associated with each set of image data.

Fastener inspection system and method

Growing community of inventors

Singapore, Singapore

Ah Kow Chin