Greatbatch Ltd.

Adrish Ganguly

Robert S Rubino

Ashish Shah

Lasantha Viyannalage

David Panek

Jeffrey Salzmann

An active implantable medical device (AIMD) has a high-purity fused silica wafer assembly micro-bonded to the housing for the device's electrical energy power source. During the micro-bonding process, electromagnetic radiation passes through the fused silica wafer but impinges on the metal housing to create a micro-bond at the interface between the two materials. A printed circuit board (PCB) assembly resides inside a power source housing recess closed by the micro-bonded fused silica wafer. Two conductive pathways extend through the fused silica wafer from electrodes supported on a body fluid side of the wafer to the PCB. The PCB, in turn, is connected to the power source to energize the electrodes for providing stimulation therapy to a patient or for sensing biological signals from the patient.

Miniature active implantable medical device having a high-purity fused silica wafer assembly micro-bonded to a titanium power source housing

An lithium-iodine electrochemical cell and method of making is described. The cell comprises a lithium anode and a cathode of a charge transfer complex which includes iodine and preferably polyvinylpyridine. The iodine-containing cathode is in operative contact with both the anode the cell casing serving as the cathode current collector. Preferably the casing is composed of stainless steel that has been thermally annealed at temperatures of 1,800&#xb0; F. or less. The annealed stainless steel has a grain size of about ASTM 7 or finer. When the iodine-containing cathode material in liquid form is filled into the casing, it contacts the inner casing surface. The passivation layer that subsequently forms at the contact interface affects cell impedance during discharge. It is desirable to maintain the internal impedance as low as possible.

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Clarence, NY, United States of America

Adrish Ganguly