Texas Instruments Corporation

Adrian Salinas

Thomas Dyer Bonifield

Jeffrey Alan West

Elizabeth Costner Stewart

Stephen Arlon Meisner

William K McDonald

Scott Alexander Johannesmeyer

Dhanoop Varghese

Robert Paul Luckin

Joel Peterson

Paul L Andres

In examples, a method of manufacturing an integrated circuit comprises locating a photomask between a light source and a semiconductor wafer having a photoresist layer in a wafer scribe lane of the wafer, wherein the photomask comprises: a first mask scribe lane pattern; a second mask scribe lane pattern matching the first mask scribe lane pattern; and at least one circuit pattern of the integrated circuit located between the first and second mask scribe lane patterns. The method further includes illuminating the photomask to produce in the photoresist layer of the wafer scribe lane a first exposed portion corresponding to the second mask scribe lane pattern; locating the first mask scribe lane pattern between the light source and the first exposed portion; and illuminating the photomask, wherein the first mask scribe lane pattern substantially shields non-exposed portions of the photoresist layer of the wafer scribe lane from light exposure.

Integrated circuit with scribe lane patterns for defect reduction

An integrated circuit a semiconductor substrate includes a device die with includes transistors configured to execute an electrical function. A first interconnect layer of the device die is configured to route electrical signals or power to terminals of the transistors. An interlevel dielectric (ILD) layer is located over the interconnect layer. A metal electrode located over the ILD layer. A dielectric barrier layer is located between the ILD layer and the metal electrode. A scribe seal surrounds the device die. A first opening within the dielectric barrier layer surrounds the metal electrode. Second and third openings within the dielectric barrier layer are located between the first opening and the scribe seal.

Hydrogen ventilation of CMOS wafers

A cleaning system which can be integrated into a coater track system for use in the production of semiconductor devices and methods for its use are provided. The cleaning system can include a series of nozzles having assorted configurations and features which provide uniform and efficient rinsing of excess material.

Photoresist dispenser with nozzle arrangement for cone-shaped spray

A method of forming a layer of photoresistover a surfaceof a semiconductor waferby forming a layer of pre-wet solventover the surfaceand forming the layer of photoresistover the layer of pre-wet solvent. Also, a layer of photoresistformed by this method.

Photoresist application over hydrophobic surfaces

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Garland, TX, United States of America

Adrian Salinas