Electro Scientific Industries, Inc.

Cathx Research Ltd

Mv Research Limited

Xsil Technology Limited

Cathx Ocean Limited

Adrian Boyle

Michael Flynn

James Mahon

Peter Conlon

Mark Douglas Owen

Oonagh Meighan

Niall Dorr

Maria Farsari

David Gillen

Kali Dunne

Kia Woon Mah

Brian Farrell

Karl Stanley

Niall Burke

Marie Flynn

Gillian Walsh

Oonagh Meignan

Fintan McKiernan

Joseph Callaghan

Aleksej Rodin

Niall Brennan

Fintan Mckiernan

Eva Fernandes Gomez

Richard Toftness

Provided are a method and system for processing image data, the method comprising: capturing raw image data of multiple images of one or more scenes under one or more lighting conditions; machine vision processing the raw image data to generate machine vision data; classifying the machine vision data according to a type of the machine vision data; and storing the classified machine vision data in a multi-tiered data structure according to the machine vision data type, configured to enable each of the tiers of data to be processed independently of each other.

Method and system for processing image data

Provided are a method and system for calibrating parameters of an imaging system comprising at least one imaging device and broad and structured light sources, the method comprising: the at least one imaging device sequentially capturing broad light source image data and structured light source image data of one or more scenes using the broad and structured light sources, respectively; generating a photogrammetric model of the broad light source image data and a photogrammetric model of the structured light source image data using respective coordinates of the broad and structured light source image data; determining corresponding features in the respective photogrammetric models; iteratively solving parameters of the imaging system to correct variations between corresponding features in the respective photogrammetric models, converge the models and obtain calibration parameters; and applying the calibration parameters to the imaging system to compensate for errors in the relative positions of the imaging device and structured light source.

Method and system for calibrating imaging system

Provided is a method for generating a 3D point cloud and colour visualisation of an underwater scene, the point cloud comprising a set of (x, y, z) coordinates relating to points in the scene, the method operating in a system comprising at least one camera module, at least one structured light source, and a processing module, each of the at least one camera module being directed at the scene and having substantially the same overlapped field of view.

3D point clouds

The present invention relates to a method of processing survey data of an underwater scene comprising acquiring an augmented image of each of a plurality of fields of view within the scene, wherein each augmented image comprises at least a scene image of the scene, a location tag associated with that scene image, and metadata associated with that scene image.

Processing survey data of an underwater scene

The present invention relates to an underwater method and system for gathering range and dimensional information of subsea objects, the system comprising a camera module suitable for capturing images of sub-sea scenes; and a reference projection light source that, in use, projects a structured light beam onto a target. The structured light beam is preferably generated by a laser and may comprise spots, lines, grids and the like.

Gathering range and dimensional information for underwater surveys

The present invention relates to methods and systems for performing underwater surveys, in particular on sub-sea installations such as oil and gas pipelines, risers, well-heads and so on. Further the invention relates to providing an augmented underwater image of a scene for use in an under-water survey, using an underwater imaging system comprising a light module, image processing module and a camera module, the light module comprising a plurality of light classes each light class having one or more light sources. The invention uses sequential imaging to provide the augmented output image.

Relation to underwater imaging for underwater surveys

A substrate is diced using a program-controlled pulsed laser beam apparatus having an associated memory for storing a laser cutting strategy file. The file contains selected combinations of pulse rate &#x394;t, pulse energy density E and pulse spatial overlap to machine a single layer or different types of material in different layers of the substrate while restricting damage to the layers and maximizing machining rate to produce die having predetermined die strength and yield. The file also contains data relating to the number of scans necessary using a selected combination to cut through a corresponding layer. The substrate is diced using the selected combinations. Gas handling equipment for inert or active gas may be provided for preventing or inducing chemical reactions at the substrate prior to, during or after dicing.

Increasing die strength by etching during or after dicing

A method of dicing a semiconductor wafer comprises scribing at least one dielectric layer along dice lanes to remove material from a surface of the wafer using a laser with a pulse-width between 1 picosecond and 1000 picoseconds and with a repetition frequency corresponding to times between pulses shorter than a thermal relaxation time of the material to be scribed. The wafer is then diced through a metal layer and at least partially through a substrate of the semiconductor wafer.

Dicing a semiconductor wafer

A formation in a first surface of a substrate is machined by an ultraviolet or visible radiation laser, to a predetermined depth that is less than a full depth of the substrate; and material is removed from a second surface of the substrate opposed to the first surface to the predetermined depth from the first surface to communicate with the formation. Material may be removed by, for example, lapping and polishing, chemical etching, plasma etching or laser ablation. The invention has application in, for example, dicing semiconductor wafers to forming metallised vias in wafers.

Methods and systems for laser machining a substrate

A die bonding method and apparatus by which a wafer substrateadhered to a carrier tapeby an adhesive layeris laser machined through the wafer substrate and through the adhesive layer at most to scribe the carrier tape to form a singulated diewith an attached singulated adhesive layer, without substantial delamination of the adhesive layerand carrier tapeor substantial production of burrs from the adhesive layer. The carrier tapeis cured, preferably by ultraviolet light, to release the adhesive layer from the carrier tape. The singulated die is picked and placed on a die pad and the adhesive layeris cured, preferably by heat, to adhere the die to the die pad.

Die bonding

A substrate () is machined to form, for example, a via. The substrate is in a chamber () within which the gaseous environment is controlled. The machining laser beam () is delivered with control of parameters such as pulsing parameters to achieve desired effects. The gaseous environment may be controlled to control integral development of an insulating lining for a via, thereby avoiding the need for downstream etching and oxide growth steps. Also, machining may be performed in multiple passes in order to minimize thermal damage and to achieve other desired effects such as a particular via geometry.

Laser machining system and method

A substrate is diced using a program-controlled pulsed laser beam apparatus having an associated memory for storing a laser cutting strategy file. The file contains selected combinations of pulse rate Deltat, pulse energy density E and pulse spatial overlap to machine a single layer or different types of material in different layers of the substrate while restricting damage to the layers and maximising machining rate to produce die having predetermined die strength and yield. The file also contains data relating to the number of scans necessary using a selected combination to cut through a corresponding layer. The substrate is diced using the selected combinations. Gas handling equipment for inert or active gas may be provided for preventing or inducing chemical reactions at the substrate prior to, during or after dicing.

Program-controlled dicing of a substrate using a pulsed laser

An illumination head () for machine vision has an annular support () with first, second, third, and fourth illumination sections (and). The third section () has three sets of LEDs () arranged in a pattern so that each set illuminates at approximately the same angle. Each set is driven in succession so that a series of three monochrome images at the same angle are captured. These are superimposed by an image processor to provide a color image, although the camera is monochrome. More information can be obtained in such a color image and the high resolution and robustness of monochrome cameras is availed of.

Machine vision

A semiconductor is cut by directing a green laser beam of high power, and subsequently directing a UV beam along the cut line. The first beam performs cutting with relatively rough edges and a high material removal rate, and the second beam completes the cut at the edges for the required finish, with a lower material quantity removal.

Laser machining of semiconductor materials

Electronic circuits such as IC packages, circuit boards, of flex circuits are singulated by laser cutting of adjoining laminated material. The laser beam has a wavelength of less than 400 nm, and either a minimum energy density of 100 J/cm2 or a minimum power density of 1GW/cm2. The method avoids the need for cleaning and intermediate handling, and there is a greatly improved throughput.

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Monasterevin, Ireland

Adrian Boyle