Applied Materials, Inc.

Adrian Blank

Steven M Zuniga

Jagan Rangarajan

Ekaterina A Mikhaylichenko

Edward Golubovsky

Jonathan Paul Domin

Balasubramaniam Coimbatore Jaganathan

Michael A Anderson

Sen-Hou Ko

Hui W Chen

Lakshmanan Karuppiah

Allen L D'Ambra

Mario Dave Silvetti

Gerald John Alonzo

Yufei Chen

A cleaning module for cleaning a wafer comprises a wafer gripping device configured to support a wafer in a vertical orientation and comprises a catch cup and a gripper assembly. The catch cup comprises a wall that has an annular inner surface that defines a processing region and has an angled portion that is symmetric about a central axis of the wafer gripping device. The gripper assembly comprises a first plate assembly, a second plate assembly, a plurality of gripping pin, and a plurality of loading pin. The gripping pins are configured to grip a wafer during a cleaning process and the loading pins are configured to grip the wafer during a loading and unloading process. The cleaning module further comprises a sweep arm coupled to a nozzle mechanism configured to deliver liquids to the front and back side of the wafer.

Non-contact clean module

Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using a disk brush. One embodiment provides a substrate cleaner comprising a substrate chuck disposed in the processing volume, and a brush assembly disposed in the processing volume, wherein the brush assembly comprises a disk brush movably disposed opposing the substrate chuck, and a processing surface of the disk brush contacts a surface of the substrate on the substrate chuck.

Disk-brush cleaner module with fluid jet

Growing community of inventors

Gilroy, CA, United States of America

Adrian Blank