Intel Corporation

Adrian Bayraktaroglu

Darko Grujicic

Rahul N Manepalli

Suddhasattwa Nad

Ravindra V Tanikella

Marcel Arlan Wall

Rengarajan Shanmugam

Roy Dittler

Sandeep Gaan

David Lampner

Ke Liu

The present disclosure is directed to a monitoring system for a plating process using a monitoring device including a metrology component for collecting agitation intensity data on at least one agitation component within a plating equipment and transferring the collected agitation intensity data to a process control station.

Agitation monitoring system for plating process

Embodiments of the present disclosure describe techniques for providing an apparatus with a substrate provided with plasma treatment. In some instances, the apparatus may include a substrate with a surface that comprises a metal layer to provide signal routing in the apparatus. The metal layer may be provided in response to a plasma treatment of the surface with a functional group containing a gas (e.g., nitrogen-based gas), to provide absorption of a transition metal catalyst into the surface, and subsequent electroless plating of the surface with a metal. The transition metal catalyst is to enhance electroless plating of the surface with the metal. Other embodiments may be described and/or claimed.

Apparatus with a substrate provided with plasma treatment

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Chandler, AZ, United States of America

Adrian Bayraktaroglu