Koninklijke Philips Corporation N.v.

U.S. Phillips Corporation

Adriaan F M Leenaars

Jacques Jules Van Oekel

A method for treating substrates, such as silicon wafers, wherein the substrates are immersed for some time in a bath containing a liquid and are taken therefrom so slowly that practically all of the liquid remains in the bath. The substrates are brought from the liquid directly into contact with a vapor of an organic solvent which is mixed with a carrier gas and introduced from gas leads having outlet nozzles. The vapor is miscible with the liquid to yield a mixture having a surface tension lower than that of the liquid, and which does not condense on the substrates. No drying marks with organic or metallic residues or other contaminations remain on the substrates.

Method and arrangement for drying substrates after treatment in a liquid

Apparatus for treating substrates, such as silicon wafers (,), wherein the substrates are immersed for some time in a bath (,) containing a liquid (,) and are taken therefrom so slowly that practically all of the liquid remains in the bath (,). The substrates (,) are brought from the liquid (,) directly into contact with a vapor of an organic solvent which is mixed with a carrier gas and introduced from gas leads (,) having outlet nozzles (,). The vapor is miscible with the liquid (,) to yield a mixture having a surface tension lower than that of the liquid, and which does not condense on the substrates. No drying marks with organic or metallic residues or other contaminations remain on the substrates (,).

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Eindhoven, Netherlands

Adriaan F M Leenaars