Rohm & Haas Electronic Materials LLC

Rohm and Haas Elcetronic Materials LLC

Adolphe Foyet

Wan Zhang-Beglinger

Margit Clauss

Michael P Toben

Yi Qin

Julia Woertink

Jonas Guebey

Jonathan D Prange

Pedro O Lopez Montesinos

Reto Buchs

Cyanide-free acidic silver electroplating compositions include one or more acids or salts of tellurium and may be used to electroplate matte silver deposits on metals, such as nickel, copper or copper alloys. Matte silver metal may be electroplated at conventional plating rates or at high plating rates, such as in reel-to-reel and jet plating. The cyanide-free acidic silver electroplating compositions may be used to electroplate matte silver in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, optical devices and decorative applications.

Cyanide-free acidic matte silver electroplating compositions and methods

Acid bismuth electroplating baths are stable and have high current efficiency over the life of the baths. The bismuth baths are easy to control because of the reduced number of bath components.

Bismuth electroplating baths and methods of electroplating bismuth on a substrate

Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.

Electroplating baths of silver and tin alloys

A thin indium metal layer is electroplated onto silver to prevent silver tarnishing. The indium and silver composite has high electrical conductivity.

Method of preventing silver tarnishing

Growing community of inventors

Lucerne, Switzerland

Adolphe Foyet