International Business Machines Corporation

Adolf E Wirsing

Leonard J Gardecki

William Thomas Motsiff

James Gardner Ryan

Sudipta Kumar Ray

Robert Michael Geffken

Kamalesh K Srivastava

Harry David Cox

Erick G Walton

Birendra N Agarwala

Paul A Totta

Arthur Bross

Karl J Puttlitz, Sr

Nicholas G Koopman

Aziz M Ahsan

Joseph G Schaefer

Doris P Pulaski

Li-Chung Lee

James R Palmer

Erik M Probstfield

David J Specht

Herbert Carl Cook

David P Daniel

Albert J Gregoritsch, Iii

Ruth A Machell Julianelle

Charles H Keeler

Mark F Chadurjian

Mary A Schaffer

David L Smith

Paul A Farrar

Eric Ernest Millham

Stuart E Greer

Paul Alden Farrar, Sr

A method of forming a semiconductor interconnect including, in the order recited: (a) providing a semiconductor wafer; (b) forming bonding pads in a terminal wiring level on the frontside of the wafer; (c) reducing the thickness of the wafer; (d) forming solder bumps on the bonding pads; and (e) dicing the wafer into bumped semiconductor chips.

Method for forming interconnects on thin wafers

A shadow mask for depositing solder bumps includes additional dummy holes located adjacent holes corresponding to most of the perimeter chips of the wafer. The additional dummy provide more uniform plasma etching of contacts of the wafer, improve etching of contacts of perimeter chips, and lower contact resistance of contacts of perimeter chips. The extra holes also provide solder bumps outside the perimeter chips that can be used to support a second shadow mask for deposition of an additional material, such as tin, on the reflowed solder bumps for mounting the chips on a plastic substrate at low temperature. An improved mask to wafer alignment aid is formed from standard solder bumps. The improved alignment aid avoids damage to test probes and provides improved course alignment.

Wafer integrated rigid support ring

A metallization composite comprises a refractory metal, nickel, and copper. The refractory metal is preferably titanium (Ti), but other suitable refractory metals such as zirconium and hafnium can also be utilized. An additional optional layer of gold can overlie the copper. The metallization composite is used to connect a solder contact to a semiconductor substrate.

Metallization composite having nickel intermediate/interface

Metallization composite having nickle intermediate/interface

The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.

Method of forming dual height solder interconnections

Solder mass having conductive encapsulating arrangement

A method and apparatus for depositing the material onto a substrate is provided. The apparatus includes a mesh member which has impregnated therein the material which is to be vapor deposited. The mesh member with the material thereon is heated to vaporize the material and the vaporized material is then deposited onto the desired substrate. Preferably the material that is deposited is maintained in a crucible having an opening and the mesh member is disposed over the opening. The material in the crucible is vaporized and condensed onto the mesh member, and the condensed material wicks through the mesh member and then revaporizes from the top of the mesh member and is deposited onto the substrates.

Method and apparatus for vapor deposition of material onto a substrate

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South Hero, VT, United States of America

Adolf E Wirsing