Intel Corporation

Aditi Mallik

Quan Anh Tran

Raghuram Narayan

Pengyue Wen

Wendai Wang

Xiaozhong Wang

Chen Zhuang

Methods and apparatus to reduce stress on lasers in optical transceivers are disclosed. An apparatus comprising a printed circuit board (PCB) having a first side and a second side opposite the first side; and a first stiffener attached to the first side of the PCB; and a photonic integrated circuit (PIC) attached to the first stiffener. The first stiffener is between the PIC and the PCB. The apparatus also includes a second stiffener attached to the second side of the PCB.

Methods and apparatus to reduce stress on lasers in optical transceivers

A semiconductor package comprises a substrate and a ceramic carrier mounted to the substrate. An integrated circuit (IC) die is mounted to the ceramic carrier. A heat extraction path away from the IC die comprises: i) a thermal interface material over the IC die, the thermal interface material having a thickness of approximately 25 to 80 um; ii) an integrated heat spreader over the thermal interface material; iii) a ceramic carrier plate over the integrated heat spreader; and iv) an electrically conductive thermal pad between the ceramic carrier plate and a housing of the semiconductor package.

Heat extraction path from a laser die using a highly conductive thermal interface material in an optical transceiver

Growing community of inventors

Cupertino, CA, United States of America

Aditi Mallik