Apple Inc.

Meta Platforms Technologies, LLC

Adar Magen

Moshe Kriman

Yazan Z Alnahhas

Kevin A Sawyer

Martin B Adamcyk

Hannah D Noble

Yu Qiao Qu

Phillip R Sommer

Wei Shi

Zhenbin Ge

Gregory A Cohoon

Colleen F Mischke

Eamon Han O'Connor

Calvin Kyaw Wong

Christopher Hu

Alan Kleiman Shwarsctein

Shay Hamer

Arun Kumar Nallani Chakravartula

Moran Koren

An illumination layer is coupled with a glass substrate. A refractive layer is overmolded over the illumination layer. The refractive layer may encapsulate light sources and electrical traces of the illumination layer. A lens curvature is formed in the refractive layer.

Optical component with illumination layer and lens curvature

An embedded ceramic substrate package includes a ceramic substrate embedded in one or more layers. The one or more layers include at least a bulk molding compound (BMC) and a redistribution layer (RDL). At least a portion of the one or more layers includes electrical signal trace routing. The embedded ceramic substrate package is attached to an image sensor that is configured to capture light projected onto a surface of the image sensor.

Camera module including embedded ceramic substrate package

A suspension assembly of a camera, with electrical traces, may be formed using one or more electroforming processes. The suspension assembly may include one or more flexure arms connecting an inner frame to an outer frame of the camera. The inner frame may be moveable relative to the outer frame to implement autofocus and/or optical image stabilization functions for the camera. The electrical traces may be formed at a first side of a substrate, using one or more electroforming processes. Next, one or more cavities in various shapes may be created in one or more dry film photoresist (DFR) layers at a second side of the substrate by exposing the DFR layers to ultraviolet light. One or more electroforming processes may be used to deposit one or more materials in to the cavities to form one or more components, e.g., a flexure arm, of the suspension assembly.

Techniques for forming suspension assemblies for a camera

An optical module includes first and second transparent substrates and a spacer between the first and second transparent substrates, holding the first transparent substrate in proximity to the second transparent substrate, with first and second diffractive optical elements (DOEs) on respective faces of the first and second transparent substrates. At least first and second capacitance electrodes are disposed respectively on the first and second transparent substrates in proximity to the first and second DOEs. Circuitry is coupled to measure changes in a capacitance between at least the first and second capacitance electrodes.

Capacitive DOE integrity monitor

A method for producing an optical apparatus includes providing a pair of glass wafers. One or more diffractive optical elements (DOEs) are formed on one or more of the glass wafers. A spacer is positioned between the glass wafers so as to define a cavity containing the DOEs, and a hermetic seal that bonds the glass wafers together and seals the cavity is formed.

Low-temperature hermetic sealing for diffractive optical element stacks

An optical module includes a diffractive optical element (DOE) with a transparent conductive trace disposed over a surface of the DOE. An emitter is configured to direct a beam of optical radiation through the DOE. Control circuitry is coupled to measure a resistance of the transparent conductive trace and to control operation of the emitter responsively to the resistance.

Light projector with integrated integrity sensor

An optical device includes a first plate having a first transparent region defining an exit face of the device, and a second plate having a second transparent region defining an entrance face of the device. At least one lens is formed over at least one of the first and second transparent regions. First and second planar reflectors are spaced apart and fixed between the first and second plates in mutually-parallel orientations diagonal to the first and second plates, thereby defining an optical path through the device from the entrance face, reflecting from the first and second reflectors, through the exit face and passing through the at least one refractive surface.

Integrated light pipe for optical projection

Manufacturing techniques for producing thin magnetic elements are designed to accommodate the mechanical properties of sintered magnetic substrates. One of the manufacturing processes involves cutting a magnetizable substrate into a number of slices and adhesively coupling the slices to a sheet that can take the form of a layer of grinding tape. After concurrently grinding a first surface of each of the slices, the slices are flipped over so that the first surface of each slice is attached to another layer of grinding tape. A second surface of each of the slices is then ground until a desired thickness is achieved. Subsequent to the grinding, dicing operations can be applied to the slices to produce magnets having a desired length and width.

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Sunnyvale, CA, United States of America

Adar Magen