Corning Incorporated

Corsam Technologies LLC

Adama Tandia

Kochuparambil Deenamma Vargheese

Mingqian He

Venkatesh Botu

Weijun Niu

Lisa Ann Lamberson

John Christopher Mauro

Xiaoju Guo

Heather Debra Boek

Mark Owen Weller

Jingshi Wu

Ellen Anne King

Jieyu Hu

Timothy Michael Gross

Matthew John Dejneka

Bruce Gardiner Aitken

Timothy James Kiczenski

Thomas Mark Leslie

James Edward Dickinson, Jr

Nadja Teresia Lönnroth

Jennifer Anella Heine

Ling Cai

Jacob George

Zhongzhi Tang

James Robert Matthews

Rohit Rai

Amit Halder

Arthur Lawrence Wallace

Daniel Edward McCauley

Lisa Anne Tietz Moore

Balamurugan Meenakshi Sundaram

Yi Zhang

Andrew Paul Schermerhorn

Sushmit Sunil Kumar Goyal

Mardochee Reveil

Yihong Mauro

Weijun Nui

Kevin Michael Erskine

Franklin Langlang Lee

Niu Weijun

Substantially alkali free glasses are disclosed with can be used to produce substrates for flat panel display devices, e.g., active-matrix liquid crystal displays (AMLCDs). The glasses have high annealing temperatures and Young's modulus. Methods for producing substantially alkali free glasses using a downdraw process (e.g., a fusion process) are also disclosed.

High strain point and high young's modulus glasses

A laminate glass article is provided that includes: a core glass layer comprising a first coefficient of thermal expansion (CTE); and a plurality of clad glass layers, each comprising a first primary surface, a second primary surface in contact with the core glass layer and a second CTE that is lower than the first CTE of the core glass layer. The difference in the first and second CTE is about 10×10/#C to about 70×10/#C. Further, each of the core glass layer and the clad glass layers comprises a viscosity from 10to 10Poise from about 550 #C to about 700 #C.

Glass articles with residual stress and viscosity properties for sagging processes, and compositions for the same

The embodiments described herein relate to low temperature moldable sheet forming glass compositions and glass articles formed from the same. In various embodiments, the glass composition comprises from about 60 mol. % to about 67 mol. % SiO, from about 6 mol. % to about 11 mol. % BO, from about 4.5 mol. % to about 11 mol. % LiO, AlO, NaO, and KO. The glass composition also includes greater than about 2 mol. % RO, where RO are divalent metal oxides, and RO from about 14 mol. % to about 20 mol. %, where RO are alkali metal oxides. The glass composition also has a glass transition temperature Tof less than about 500&#xb0; C., a softening point of less than about 650&#xb0; C., and a coefficient of thermal expansion (CTE) of less than about 85&#xd7;10K.

Low temperature moldable sheet forming glass compositions

An article including a glass having that includes SiO, AlO, and BOand least one of LiO, NaO, KO, MgO, CaO, SrO, BaO, SnO, ZnO, LaO, F, and FeO, wherein the glass includes a dielectric constant of about 10 or less and/or a loss tangent of about 0.01 or less, both as measured with signals at 10 GHz.

Low dielectric loss glasses for electronic devices

The embodiments described herein relate to low temperature moldable sheet forming glass compositions and glass articles formed from the same. In various embodiments, the glass composition comprises from about 60 mol. % to about 67 mol. % SiO, from about 6 mol. % to about 11 mol. % BO, from about 4.5 mol. % to about 11 mol. % LiO, AlO, NaO, and KO. The glass composition also includes greater than about 2 mol. % RO, where RO are divalent metal oxides, and RO from about 14 mol. % to about 20 mol. %, where RO are alkali metal oxides. The glass composition also has a glass transition temperature Tof less than about 500 C, a softening point of less than about 650 C, and a coefficient of thermal expansion (CTE) of less than about 85&#xd7;10K.

Compositions are included comprising heterocyclic organic compounds based on fused thiophene compounds, polymers based on fused thiophene compounds, and methods for making the monomers and polymer along with uses in thin film-based and other devices.

Semiconducting co-polymers of methylenedihydropyrazines with fused thiophenes

Techniques for screening homopolymers, copolymers or blends for fabrication are disclosed. A data repository stores data points. Each data point comprises a structural repeating unit (SRU) and at least one material property value for the SRU. Each SRU is a homopolymer SRU, a copolymer component SRU or a blend component SRU. A machine determines a fingerprint for at least a subset of the SRUs in the data repository. The machine stores, in the data repository, each determined fingerprint in conjunction with a corresponding SRU. The machine generates a quantitative modeling engine to predict material property values, based on SRUs, for homopolymers, copolymers or blends. The quantitative modeling engine is based, at least in part, on the fingerprints. The machine identifies, using the quantitative modeling engine, at least one homopolymer SRU, copolymer SRU set or blend SRU set that has a material property value within a given range.

System and method for screening homopolymers, copolymers or blends for fabrication

Systems and techniques for image segmentation into overlapping tiles are described herein. In an example, an anomaly detection system for super-high-resolution images is adapted to divide the image into tiles with a size and overlap between each tile, wherein the size and overlap is determined using a machine-learning model. The anomaly detection system may be further adapted to use a classifier model for each tile to identify anomaly presence in the tile, wherein the classifier model is trained using a data set of tile size images that are labeled according to anomaly presence in each tile size image. The anomaly detection system may be further adapted to determine a classification for the image based on results from the classifier model for the tiles. The anomaly detection system may be further adapted to output the classification.

Image segmentation into overlapping tiles

Alkali-doped and alkali-free boroaluminosilicate glasses that include barium oxide and the network formers SiO, BO, and AlO. The glasses may be doped with up to about 1 mol % of LiO, NaO, and/or KO. The glass may, in some embodiments, have a Young's modulus of less than about 61 GPa and/or a coefficient of thermal expansion, averaged over a temperature range from about 20&#xb0; C. to about 300&#xb0; C., of less than about 40&#xd7;10/&#xb0; C. These glasses may be used as a cover glass for electronic devices, a color filter substrate, a thin film transistor substrate, or an outer clad layer for a glass laminate.

Alkali-doped and alkali-free boroaluminosilicate glass

Alkali aluminosilicate glasses that exhibit fast ion exchange performance and having low softening points that enable the glasses to be formed into non-planar, three-dimensional shapes. The glasses contain less than about 1 mol % of boron oxide and, in some embodiments, are substantially free of BO. Furthermore, these glasses have excess amounts of alkali oxides relative to both AlOand PO, in order to improve melting behavior and ion exchange performance while still achieving sufficiently low softening points to allow for formability.

Fast ion-exchangeable boron-free glasses with low softening point

Described herein are heterocyclic organic compounds. More specifically, described herein are compounds based on the combination of fused pyrrole structures with diketopyrrolopyrrole structures, methods for making these compounds, and uses thereof. The compounds disclosed have improved electronic, polymerization and stability properties that allow for improved material processibility and inclusion in organic semiconductor devices.

Dihydropyrrolo[2,3-F] indole-diketopyrrolopyrrole semiconducting materials, and methods and uses thereof

Described herein are heterocyclic organic compounds. More specifically, described herein are compounds based on the combination of fused pyrrole structures with diketopyrrolopyrrole structures, methods for making these compounds, and uses thereof. The compounds disclosed have improved electronic, polymerization and stability properties that allow for improved material processability and inclusion in organic semiconductor devices.

Dihydropyrrolo[2,3-F]indole-diketopyrrolopyrrole semiconducting materials, and methods and uses thereof

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Nelson, PA, United States of America

Adama Tandia