Bar-ilan University

Birad-research & Development Company Ltd.

Ben-gurion University of the Negev Research and Development Authority

Mellanox Technologies, Ltd.

Adam Teman

Alexander Fish

Robert Giterman

Pascal Meinerzhagen

Andreas Burg

Tzachi Noy

Lidor Pergament

Omer Cohen

Elad Mentovich

Yoav Weizman

Yehuda Kra

Narkis Geuli

Amir Shalom

Lior Atias

A method for minimizing the skew (balancing) between all paths arriving at the inputs ports of each gate within a given combinatorial circuit.

Skew-balancing algorithm for digital circuitry

An FD-SOI GC-edRAM gain cell includes: The FD-SOI transistors are interconnected to form a storage node for retaining a data signal. The bodies of at least two of the transistors are coupled in a single well to a body voltage terminal. The write trigger signal triggers writing an input data signal from the write bit line terminal to the storage node and the read trigger signal triggers outputting the retained data signal from the storage node to the read bit line terminal.

Gain cell embedded DRAM in fully depleted silicon-on-insulator technology

A FinFET gain cell includes a write port, read port and storage node. The write port includes at least one write FinFET transistor and has write word-line (WWL) and write bit-line (WBL) inputs. The read port includes at least one FinFET read transistor and has a read word-line (RWL) input and a read bit-line (RBL) output. The storage node stores a data level written from said WBL. The storage nodes includes a single layer interconnect which connects the write port output diffusion connection to the read port input gate connection. The height of the single layer interconnect at the write port output diffusion connection is different from the height of the single layer interconnect at the read port input gate connection.

Fin-FET gain cells

A CDMR memory cell, includes a first bitcell which is used to store a current data level and a second bitcell which is used to store the complementary data level. When a read operation is performed, a comparator compares the data levels read from the two bitcells. If these two levels are not complementary, the comparator outputs an indicator. This indicator serves as an alert that a storage error has, or may have, occurred.

Complementary dual-modular redundancy memory cell

A method uses data retention time (DRT) characteristics of a logic-compatible gain-cell embedded DRAM (dynamic random-access memory) (GC-eDRAM) array in a transistor circuit as a source for physical unclonable function (PUF) signature extraction of the circuit.

Dynamic memory physical unclonable function

A method of operating a first-in-first-out memory, called a FIFO, includes performing write and read operations of data with a FIFO. The FIFO has a size fifo_size and a maximum retention time. Once a datum is written to the FIFO, there is a limit of fifo_size-1 write operations before the datum becomes invalid and there is a limit of fifo_size-1 read operations before the datum is read, and the data is refreshed before reaching the maximum retention time. During the refreshing, the FIFO is available for further write and read operations.

Refresh controller for first-in first-out memories

A high-density memory includes: a data write interface, a data read interface, an array of memory cells and level-shifting write drivers. The data write interface inputs data written to the memory. The data read interface outputs data read from the memory. The array of memory cells stores data input at the data write interface and outputs stored data to the data read interface. Each of the memory cells includes at least one low threshold voltage (LVT) read transistor and at least one respective regular threshold voltage (RVT) transistor, so as to obtain high-speed read operations. The level-shifting write drivers supply shifted write wordline voltages to the array, so as to obtain high-speed write operations.

High-density memory macro

A gain cell includes a write bit line input, a read bit line output, a write trigger input and a read trigger input. The write element writes a data level from the write bit line input to the gain cell when triggered by the write trigger input. The retention element buffers between an internal buffer node and an internal storage node during data retention. The retention element also connects or disconnects the buffer node to a first constant voltage according to the data level being retained in the gain cell. The read element decouples the storage node from the read bit line output during data read. The read element also connects and disconnects the read bit line output to a second constant voltage according to the data level being read from the gain cell.

Transistor gain cell with feedback

A gain cell includes a write bit line input, a read bit line output, a write trigger input and a read trigger input. The gain cell also includes a write transistor, retention element and read transistor. Each of the transistors includes a respective first diffusion connection, gate connection and second diffusion connection. The write transistor first diffusion connection is connected to the write bit line input and the write transistor gate connection is connected to the write trigger input. The read transistor first diffusion connection being connected to the read bit line output and the second diffusion connection is connected to the read trigger input. The retention element buffers between write transistor and the read transistor during data retention. The retention element also connects or disconnects a write transistor diffusion connection to/from a constant voltage in accordance with a retained data level at the read transistor gate connection.

A memory cell with an internal supply feedback loop is provided herein. The memory cell includes a latch having two storage nodes Q and QB, and a supply node. A gating device couples the supply node of the latch to the supply voltage. The gating device is controlled by a feedback loop coming from storage node QB. Due to the aforementioned asymmetric topology, the writing of logic '1' and the writing of logic '0' are carried out differently. Contrary to standard SRAM cells, in the hold states, only the QB storage node presents a valid value of stored data. The feedback loop cuts off the supply voltage for the latch such that the latch is no longer an inverting latch. By cutting off the supply voltage at the stable hold states, while maintaining readability of the memory cell, leakage currents associated with the hold states are eliminated altogether.

Ultra low power memory cell with a supply feedback loop configured for minimal leakage operation

An SRAM memory cell with an internal supply feedback loop is provided herein. The memory cell includes a latch that has a storage node Q, a storage node QB, a supply node, and a ground node. The supply node is coupled via a gating device to a supply voltage and ground node is connected to ground. In addition, storage node Q is fed back via feedback loop into a control node of the gating device. In operation, writing into the memory cell may be carried out in a similar manner to dual port SRAM cells, utilizing one or two write circuitries and for writing into storage node Q and storage node QB respectively. Differently from standard SRAM cells, the feedback loop, by controlling the gating device is configured to weaken the write contention.

Growing community of inventors

Tel-Mond, Israel

Adam Teman